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Improvement of Adhesion strength between Cu-based Leadframe and Epoxy Molding Compound
Improvement of Adhesion strength between Cu-based Leadframe and Epoxy Molding Compound
상세정보
- 자료유형
- 기사
- ISSN
- 12297607
- 저자명
- Ho Young Lee
- 서명/저자
- Improvement of Adhesion strength between Cu-based Leadframe and Epoxy Molding Compound / Ho Young Lee
- 발행사항
- 서울 : 한국전기전자재료학회, 2001.
- 형태사항
- pp. 23-28
- 주기사항
- Includes Bibliography
- 원문정보
- url
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60232538
MARC
008190927s2001 ulk aa eng■022 ▼a12297607
■1001 ▼aHo Young Lee
■24510▼aImprovement of Adhesion strength between Cu-based Leadframe and Epoxy Molding Compound▼dHo Young Lee
■260 ▼a서울▼b한국전기전자재료학회▼c2001.
■300 ▼app. 23-28
■500 ▼aIncludes Bibliography
■773 ▼tTransactions on Electrical and Electronic Materials▼gVol.1, No.3 (2000 September)▼d2001, 09
■856 ▼uhttp://www.kieeme.or.kr
■SIS ▼aS014490▼b60055341▼h8▼s2▼fP
