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961
Sub-60-nm Lithography Patterns by Low-Energy Microcolumn Lithography
Sub-60-nm Lithography Patterns by Low-Energy Microcolumn Lithography
H. S. Kim, | 한국물리학회 | 2007 ,
962
(핵심) 정신건강간호
(핵심) 정신건강간호
Shives, Louise Rebraca, 512.8385-S558저 | 군자출판사 | 2009 512.8385-S558저,
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모체등록번호 딸림등록번호 서명 별치기호 자료상태 소장처
0281864 M003890 (핵심) 정신건강간호 CR 대출가능 문학자료실(관광학관1층)
0279111 M003815 (핵심)정신건강간호 CR 대출가능 문학자료실(관광학관1층)
963
Measurement of the Resonance Frequency, the Loss Factor, and the Dynamic Young's Modulus in Structural Steel and Polycarbonate by Using an Acoustic Velocity Sensor
Measurement of the Resonance Frequency, the Loss Factor, and the Dynamic Young's Modulus in Structural Steel and Polycarbonate by Using an Acoustic Velocity Sensor
Sung Soo Jung, | 한국물리학회 | 2006 ,
964
Effects of Process Parameter for LiNbO₃ Optical Waveguide Prepared by Neutral Loop Discharge Plasma Etching
Effects of Process Parameter for LiNbO₃ Optical Waveguide Prepared by Neutral Loop Discharge Plasma Etching
W. J. Park, | 한국물리학회 | 2006 ,
965
러브 온 더 로드
러브 온 더 로드
쉐이먼, 대니, 843-쉐'68러 | 밀리언하우스 | 2010 843-쉐'68러,
966
Study on a Partial Discharge Test fof Low-Voltage Electronic Components
Study on a Partial Discharge Test fof Low-Voltage Electronic Components
Gyung-Suk Kil, | 한국물리학회 | 2006 ,
967
CF₄-Based Neutral-Beam Etch Characteristics of Si and SiO₂Using a Low-Angle forward-Reflected Neutral-beam Etching System
CF₄-Based Neutral-Beam Etch Characteristics of Si and SiO₂Using a Low-Angle forward-Reflected Neutral-beam Etching System
D. H. Lee, | 한국물리학회 | 2006 ,
968
Hot Carrier Effect in Low-Temperature Poly-Si TFTs with Sputtered Gate SiO₂ Films
Hot Carrier Effect in Low-Temperature Poly-Si TFTs with Sputtered Gate SiO₂ Films
YuKiharu Uraoka, | 한국물리학회 | 2006 ,
969
Advanced Microcolumn Operation for Low-Energy Electron-Beam Lithography
Advanced Microcolumn Operation for Low-Energy Electron-Beam Lithography
Y. C. Kim, | 한국물리학회 | 2006 ,
970
Effect of Process Parameters of UV-Assisted Gas-Phase Cleaning on the Removal of PEG (Polyethyleneglycol) from a Si Substrate
Effect of Process Parameters of UV-Assisted Gas-Phase Cleaning on the Removal of PEG (Polyethyleneglycol) from a Si Substrate
Sung Ku Kwon, | 한국물리학회 | 2006 ,
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