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81
On the Design of the Latch Mecahnism for Wafer Containers in a SMIF Environment
On the Design of the Latch Mecahnism for Wafer Containers in a SMIF Environment
Jyh-Jone Lee., | 대한기계학회 | 2006 ,
82
Dietary Patterns and Acculturation of Korean American Dults and Adolescents Living in California
Dietary Patterns and Acculturation of Korean American Dults and Adolescents Living in California
S. Park., | 대한지역사회영양학회 | 2006 ,
83
Brittle Failure and Effect of Thermal Aging on Pb-free Solder Flip Chip Using Electroless Ni-P UBM
Brittle Failure and Effect of Thermal Aging on Pb-free Solder Flip Chip Using Electroless Ni-P UBM
Yong Min Kwon, | 대한금속재료학회 | 2006 ,
84
High Frequency Properties of Anisotropic Conductive Films (ACFs) for Flip Chip Package Application
High Frequency Properties of Anisotropic Conductive Films (ACFs) for Flip Chip Package Application
Myung Jin Vim, | 대한금속재료학회 | 2006 ,
85
Review of Electrically Conductive Adhesive Technologies for Electronic Packaging
Review of Electrically Conductive Adhesive Technologies for Electronic Packaging
Myung Jin Yim, | 대한금속재료학회 | 2006 ,
86
DMB Market in Korea : Service, Device and the Future
DMB Market in Korea : Service, Device and the Future
Kim, David, | 한국인터넷정보학회 | 2006 ,
87
Recognizing emotional content of emails as a byproduct of natural language processing-based metadaga extraction
Recognizing emotional content of emails as a byproduct of natural language processing-based metadaga extraction
Paik Woojin, | 한국정보관리학회 | 2006 ,
88
Analysis of Korean patent & Trademark retrieval query log to inprove retrieval and query refomulation effciency
Analysis of Korean patent & Trademark retrieval query log to inprove retrieval and query refomulation effciency
Lee Jee Yeon, | 한국정보관리학회 | 2006 ,
89
Probiotic Properties of Lactobacillus plantarum NK181 Isolated from Jeotgal, a Korean Fermented Food
Probiotic Properties of Lactobacillus plantarum NK181 Isolated from Jeotgal, a Korean Fermented Food
Na-Kyoung Lee, Hyoun-Wook Kim, Hyo-Ihl Chang, Che, | Korean Societyof Food Science&Technology | 2006 ,
90
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity
Myung Jin Yim, Hyoung Joon Kim, Kyung Wook Paik, | 한국마이크로전자및 패키징학회 | 2005 ,
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