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801
Analysis of Traumatic Brain Injury Using a Finite Element Model
Analysis of Traumatic Brain Injury Using a Finite Element Model
Chang-Min Suh, Sung-Ho Kim, Sang-Yeob Oh, | 대한기계학회 | 2005 ,
802
Changes in Microorganisms, Enzyme Activities, and Gas Formation by the Addition of Mustard Powder on Kochujang with Different Salt Concentration
Changes in Microorganisms, Enzyme Activities, and Gas Formation by the Addition of Mustard Powder on Kochujang with Different Salt Concentration
Ji-Young Oh, Yong-Suk Kim, Dong-Hwa Shin, | Korean Societyof Food Science&Technology | 2006 ,
803
Antioxidative Effect of Crude Anthocyanins in Water-in-Oil Microemulsion System
Antioxidative Effect of Crude Anthocyanins in Water-in-Oil Microemulsion System
Ju Kyoung Oh, Seok Joong Kim, Jee-Young Imm, | Korean Societyof Food Science&Technology | 2006 ,
804
Antimicrobial Effect of Roselle (Hibiscus sabdariffa L.) Petal Extracts on Food-Borne Microorganisms
Antimicrobial Effect of Roselle (Hibiscus sabdariffa L.) Petal Extracts on Food-Borne Microorganisms
Pil-Sung Kang, Ki-Bum Park, Jae-Soon Eun, Suk-Heu, | Korean Societyof Food Science&Technology | 2006 ,
805
Using Focus Groups to Assess Nutrition Education Needs for Pregnant and Lactating Women in Korea
Using Focus Groups to Assess Nutrition Education Needs for Pregnant and Lactating Women in Korea
Kyung A Kim, Se-Young Oh, | 한국영양학회 | 2005 ,
806
Effects of the β 3-Adrenergic Receptor Genotype on Hyperglycemic Risk Among Korean Women
Effects of the β 3-Adrenergic Receptor Genotype on Hyperglycemic Risk Among Korean Women
Hyun Hee Oh, Kil Soo Kim, Sun Mi Choi, Hyun Sung, | 한국영양학회 | 2003 ,
807
Thermal Transient Characteristics of Die Attach in High Power LED Package
Thermal Transient Characteristics of Die Attach in High Power LED Package
Hyun-Ho Kim, Sang-Hyun Choi, Sang-Hyun Shin, Youn, | 한국마이크로전자및 패키징학회 | 2005 ,
808
Characteristics of Ni/Co Composite Silicides for Poly-silicon Gates
Characteristics of Ni/Co Composite Silicides for Poly-silicon Gates
Sangyeob Kim, Youngsoon Jung, Ohsung Song, | 한국마이크로전자및 패키징학회 | 2005 ,
809
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Kwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho L, | 한국마이크로전자및 패키징학회 | 2005 ,
810
Process Design for the Hot Forging of Asymmetric Rail to Symmetric Rail
Process Design for the Hot Forging of Asymmetric Rail to Symmetric Rail
Hae Yong Cho, Yong Yun, Kim, Ki Joung Lee, Sung H, | 대한기계학회 | 2004 ,
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