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731
Phase Transformation and Microstructural Features of NiAl/Ni₃Al Two-Phase Alloys Containing Ternary Elements
Phase Transformation and Microstructural Features of NiAl/Ni₃Al Two-Phase Alloys Containing Ternary Elements
S.H. Song, S.H. Kim, Y.H. Hong, | 대한금속.재료학회 | 2004 ,
732
Nutritional Status and Bone Mineral Density of Elderly Women in Asan
Nutritional Status and Bone Mineral Density of Elderly Women in Asan
JS Kim, YS Kwon, YJ Shin, | 대한지역사회영양학회 | 2005 ,
733
Biochemical Nutritional Status of Serum Lipids, Protein, and Bllod Glucose in School Children in Bucheon
Biochemical Nutritional Status of Serum Lipids, Protein, and Bllod Glucose in School Children in Bucheon
JO Koo, SK Kim, DM Shin, | 대한지역사회영양학회 | 2005 ,
734
Change in Quality Characteristics of Yeast Dried by Various Methids
Change in Quality Characteristics of Yeast Dried by Various Methids
Suk Shin Kim, | 한국산업식품공학회 | 2001 ,
735
Application of ORP and pH as Controlling Factors in Sequencing Batch Reactor
Application of ORP and pH as Controlling Factors in Sequencing Batch Reactor
Hong-Tae Kim, Gwang-Seob Kim, Seok-Woo Shin, | 대한토목학회 | 2005 ,
736
Development of the Booklet, "Prevention and Management of Hypertension for Older Adults"
Development of the Booklet, "Prevention and Management of Hypertension for Older Adults"
KW Kim, HJ Kang, EM Shin, | 대한지역사회영양학회 | 2004 ,
737
A Study on the Characteristics of Rolling Barriers
A Study on the Characteristics of Rolling Barriers
Kyung-Whan Kim, Bu-Yong Shin, | 대한토목학회 | 2004 ,
738
Economic Feasibility Analysis of Roadway Capacity Expansion with Accounting Traffic Noise Barrier Cost
Economic Feasibility Analysis of Roadway Capacity Expansion with Accounting Traffic Noise Barrier Cost
Keechoo Choi, Jeong-Hyun Kim, Kangwon Shin, | 대한토목학회 | 2004 ,
739
Separation of Oxide Inclusions from Liguid Metal in an Applied Electrostatic Field
Separation of Oxide Inclusions from Liguid Metal in an Applied Electrostatic Field
Jae H Kim,Jung M Lee,Ho C Shin,Young H Paik, | 대한금속.재료학회 | 2003 ,
740
Dissolution of Cu Into Sn-Bases Solders during Reflow Slldering
Dissolution of Cu Into Sn-Bases Solders during Reflow Slldering
Jong-Hyun Lee,Dong-Hyuk Shin,Yong-Seog Kim, | 대한금속.재료학회 | 2003 ,
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