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521
(Danny Goodman's) Java script handbook
(Danny Goodman's) Java script handbook
Goodman, Danny, 005.71-G653j | IDG Books | 1996 005.71-G653j,
522
Java for dummies
Java for dummies
Walsh, Aaron E., 005.71-W223j | IDG Books Worldwide | 1996 005.71-W223j,
딸림정보
딸림정보
모체등록번호 딸림등록번호 서명 별치기호 자료상태 소장처
UW64917 M003027 Java for dummies CR 대출가능 문학자료실(관광학관1층)
UW23236 M003028 Java for dummies CR 대출가능 문학자료실(관광학관1층)
523
Java AWT reference : Java 1.1
Java AWT reference : Java 1.1
Zukowski, John, 005.71-Z94j | O'Reilly&Associates, Inc | 1997 005.71-Z94j,
524
AWT programming for Java
AWT programming for Java
O'Neal, Miles, 005.13-O'58a | M&T | 1997 005.13-O'58a,
525
Antioxidant Activity of Extracts from Dangyuja (Citrus Grandis Osbeck) Fruits Produced in Jeju Island
Antioxidant Activity of Extracts from Dangyuja (Citrus Grandis Osbeck) Fruits Produced in Jeju Island
Hee-Kyoung Lim, Eun-Sook Yoo, Jeong-Yong Moon, Yo, | Korean Societyof Food Science&Technology | 2006 ,
526
Ethanol Extract of Oenanthe javanica Modulates Inflammatory Response by Inhibiting NF-kB Mediated Cyclooxygenase-2 Expression in RAW 264.7 Macrophage
Ethanol Extract of Oenanthe javanica Modulates Inflammatory Response by Inhibiting NF-kB Mediated Cyclooxygenase-2 Expression in RAW 264.7 Macrophage
Jeongmin Lee, Namjoo Kim, Dong-Hyeok Cho, Min-You, | Korean Societyof Food Science&Technology | 2006 ,
527
Physicochemical Properties of japonica Non-Waxy and Waxy Rice during Kernel Development
Physicochemical Properties of japonica Non-Waxy and Waxy Rice during Kernel Development
Sung-Kon Kim, Sun-Ok Jung, | Korean Societyof Food Science&Technology | 2006 ,
528
Probiotic Properties of Lactobacillus plantarum NK181 Isolated from Jeotgal, a Korean Fermented Food
Probiotic Properties of Lactobacillus plantarum NK181 Isolated from Jeotgal, a Korean Fermented Food
Na-Kyoung Lee, Hyoun-Wook Kim, Hyo-Ihl Chang, Che, | Korean Societyof Food Science&Technology | 2006 ,
529
Java foundation classes
Java foundation classes
Nelson, Matthew T., 005.71-N428j | McGraw-Hill | 1998 005.71-N428j,
530
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Kwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho L, | 한국마이크로전자및 패키징학회 | 2005 ,
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