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31
Analysis of Ring Pack Lubricatoin
Analysis of Ring Pack Lubricatoin
Jae-Seon Lee,Dong-Chul Han, | 대한기계학회 | 2000 ,
32
Evaluation of Thermal Deformation in Electronic Packages
Evaluation of Thermal Deformation in Electronic Packages
Hyeon Gyu Beom, | 대한기계학회 | 2000 ,
33
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Young Bae Par, Dok Won Lee, | 대한금속.재료학회 | 2001 ,
34
Adaptive Mesh Generation By Bubble Packing Method
Adaptive Mesh Generation By Bubble Packing Method
Jeong-Hun Kim, Hung-Gyu Kim, Byung-Chai Lee and S, | 국제구조공학회 | 2003 ,
처음이전1234마지막
1
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
2
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
3
Advanced Packaging
Penn Well Publishing Co. [, ]
4
Chas Wolff Packing Company v. Court of Industrial Relations of the State of Kansas
Great Neck Publishing [, ]
5
Hewlett-Packard Journal
Hewlett-Packard Co. [, ]