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31
IEEE 802.17 기반의 Resilient Packet Ring 기술과 표준화 동향
IEEE 802.17 기반의 Resilient Packet Ring 기술과 표준화 동향
이재훈, | 대한전자공학회 | 2005 ,
32
Processing Strategies for Enhanced Resistance to Impact Fracture of Thin Small-Outline Packages
Processing Strategies for Enhanced Resistance to Impact Fracture of Thin Small-Outline Packages
Seong-Min Lee, | 대한금속.재료학회 | 2003 ,
33
MMIC Packaging : MMIC 기술-대특집
MMIC Packaging : MMIC 기술-대특집
김용훈, | 대한전자공학회 | 2002 ,
34
Friction Characteristics of Piston Ring Pack with Consideration of Mixed Lubrication : Parametric Investigation
Friction Characteristics of Piston Ring Pack with Consideration of Mixed Lubrication : Parametric Investigation
Kim Ji-Young,Kim Jee-Woon,Cho Myung-Rae,Han Dong-, | 대한기계학회 | 2002 ,
35
Analysis of Ring Pack Lubricatoin
Analysis of Ring Pack Lubricatoin
Jae-Seon Lee,Dong-Chul Han, | 대한기계학회 | 2000 ,
36
Evaluation of Thermal Deformation in Electronic Packages
Evaluation of Thermal Deformation in Electronic Packages
Hyeon Gyu Beom, | 대한기계학회 | 2000 ,
37
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Young Bae Par, Dok Won Lee, | 대한금속.재료학회 | 2001 ,
38
Adaptive Mesh Generation By Bubble Packing Method
Adaptive Mesh Generation By Bubble Packing Method
Jeong-Hun Kim, Hung-Gyu Kim, Byung-Chai Lee and S, | 국제구조공학회 | 2003 ,
39
Graphis packaging, 8 : an international compilation of package design, ein internationaler uberblick uber die packungsgestaltung, un repetoire international des formes d'emballage
Graphis packaging, 8 : an international compilation of package design, ein internationaler uberblick uber die packungsgestaltung, un repetoire international des formes d'emballage
Pedersen , B. Martin, 658-P371g | Graphis | 2000 658-P371g,
40
The packaging designer's book of patterns
The packaging designer's book of patterns
Roth , Laszlo, 326.12-R845p | John Wiley | 2000 326.12-R845p,
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1
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
2
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
3
Advanced Packaging
Penn Well Publishing Co. [, ]
4
Chas Wolff Packing Company v. Court of Industrial Relations of the State of Kansas
Great Neck Publishing [, ]
5
Hewlett-Packard Journal
Hewlett-Packard Co. [, ]