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21
Plant Regeneration of Turf-Type Common Bermudagrass (Cynodon dactylon) via Somatic Embryogenesis from Seed-Derived Callus
Plant Regeneration of Turf-Type Common Bermudagrass (Cynodon dactylon) via Somatic Embryogenesis from Seed-Derived Callus
Zang, Yun Xiang, | 한국원예학회 | 2006 ,
22
Multivariate Posson Distribution Generated via Reduction from Independent Poisson Variates
Multivariate Posson Distribution Generated via Reduction from Independent Poisson Variates
Kim Daehak, | 한국데이터정보과학회 | 2006 ,
23
Switching Regression Analysis via Fuzzy LS-SVM
Switching Regression Analysis via Fuzzy LS-SVM
Hwang Changha, | 한국데이터정보과학회 | 2006 ,
24
Online experts screening the worst slicing machine ro control wafer yield via the analytic hierarchy process
Online experts screening the worst slicing machine ro control wafer yield via the analytic hierarchy process
Lin, Chin-Tsai, | 한국품질경영학회 | 2006 ,
25
Cognitive UWB-OFDM: Pushing Ultra-Wideband Beyond Its Limit via Opportunistic Spectrum Usage
Cognitive UWB-OFDM: Pushing Ultra-Wideband Beyond Its Limit via Opportunistic Spectrum Usage
Arslan, Huseyin, | 한국통신학회 | 2006 ,
26
via를 이용한 3차원 패키징 기술
via를 이용한 3차원 패키징 기술
홍성준, | 대한용접학회 | 2006 ,
27
The-Hypocholesterolemic Effect of Green Tea-EGCG Was Not Mediated Via the Stimulation of the Low-Density Lipoprotein Receptor Gene Expression in Cholesterol-Fed Rats
The-Hypocholesterolemic Effect of Green Tea-EGCG Was Not Mediated Via the Stimulation of the Low-Density Lipoprotein Receptor Gene Expression in Cholesterol-Fed Rats
Hee-Jung Moon, Yangha Kim, | 한국영양학회 | 2005 ,
28
A Synthesis of Spherical Shape TiO₂-SiO₂Complex via Solvothermal Process and Thermal Properties at Non-Isothermal
A Synthesis of Spherical Shape TiO₂-SiO₂Complex via Solvothermal Process and Thermal Properties at Non-Isothermal
Tae-Hwan Cho, Seong-Jin Park, | 한국마이크로전자및 패키징학회 | 2005 ,
29
Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling
Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling
J. S. Bae, G. H. Chang, J. H. Lee, | 한국마이크로전자및 패키징학회 | 2005 ,
30
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Kwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho L, | 한국마이크로전자및 패키징학회 | 2005 ,
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Scandinavian Cardiovascular Journal. Supplement
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Scandinavian Journal of Behaviour Therapy
Scandinavian University Press International Division [, ]
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Scandinavian Journal of Caring Sciences
Blackwell Publishing Limited [, ]
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Scandinavian Journal of Caring Sciences
Blackwell Publishing Limited [, ]
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Scandinavian Journal of Clinical & Laboratory Investigation
Taylor & Francis Ltd [, ]
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Scandinavian Journal of Educational Research
Carfax Publishing Company [, ]
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Scandinavian Journal of Food & Nutrition
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