본문

Multilingual
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S. S. Pendhari., | 국제구조공학회(TECNO-PRESS) | 2006 ,
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Su Cheol Gong, In Jea Back, Jae Hyouk Yoo, Hun Se, | 한국마이크로전자및 패키징학회 | 2005 ,
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Bohyun Chon, Byeong-Ho Yu, | 한국암반공학회 | 2001 ,
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VSP International Science Publishers [, ]
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Budapest University of Technology & Economics [, ]
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한국섬유공학회 [제조업, ]
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VSP International Science Publishers [, ]
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Kluwer Academic Publishing / Academic [, ]
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Kluwer Academic Publishing / Academic [, ]
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Marcel Dekker Inc. [, ]
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Taylor & Francis Ltd [, ]
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Rapra Technology [, ]