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21
Effect of Active Modified Atmosphere Packaging and Storage Temperature on the Quality of Spinach
Effect of Active Modified Atmosphere Packaging and Storage Temperature on the Quality of Spinach
Jong Nam Park, Jang Hun Kyoung, Cheon Soon Jeong, | 한국원예학회 | 2006 ,
22
Non-Destructive Evaluation of Semiconductor Package by Electronic Speckle Pattern Interferometry
Non-Destructive Evaluation of Semiconductor Package by Electronic Speckle Pattern Interferometry
Koungsuk Kim, Kisoo Kang, Seungtack Jung, | 대한기계학회 | 2005 ,
23
Rectangle Packing 방식 기반 NoC 테스트 스케쥴링
Rectangle Packing 방식 기반 NoC 테스트 스케쥴링
안진호, 김근배, 강성호, | 대한전자공학회 | 2006 ,
24
Effect of Packing Size on Chomatographic Separation of Cetechin Compounds in Green Tea
Effect of Packing Size on Chomatographic Separation of Cetechin Compounds in Green Tea
Ji Hoon Kang, Seung Bum Hong, Jung Il Kim, Sung T, | 한국화학공학회 | 2000 ,
25
Thermomechanical Stability of Memory Package with LOC Structure
Thermomechanical Stability of Memory Package with LOC Structure
Seong-Min Lee, | Metals and Materials | 2005 ,
26
Mechanical Strength Test Method for Solder Ball Joint in BGA Package
Mechanical Strength Test Method for Solder Ball Joint in BGA Package
Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung, | Metals and Materials | 2005 ,
27
Antioxidant-impregnated Food Packaging Materials for Inhibition of Lipid Oxidation
Antioxidant-impregnated Food Packaging Materials for Inhibition of Lipid Oxidation
Han-Seung Shin, Younsuk Lee, | Korean Societyof Food Science&Technology | 2003 ,
28
Packed Tower 설계기술 : 환경공학 실무를 위한
Packed Tower 설계기술 : 환경공학 실무를 위한
김일배., 539.9-김69p | 처용 | 1999 539.9-김69p,
29
Active Packaging Systems For Preventing Oxidation
Active Packaging Systems For Preventing Oxidation
Kwang Seon Choi, Seok In Hong, Seok Min Son, | 한국산업식품공학회 | 2003 ,
30
Microwave Heating Effect on Mechnacal Properties of Food Packing Films
Microwave Heating Effect on Mechnacal Properties of Food Packing Films
Jun Ho Lee, Eun Ju Seog, Rakesh K. Single, | 한국산업식품공학회 | 2001 ,
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1
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
2
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
3
Advanced Packaging
Penn Well Publishing Co. [, ]
4
Chas Wolff Packing Company v. Court of Industrial Relations of the State of Kansas
Great Neck Publishing [, ]
5
Hewlett-Packard Journal
Hewlett-Packard Co. [, ]