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221
Improvement of Interfacial Performances on Insulating and Semi-Conducting Silicone Polymer Joint by Plasma-treatment
Improvement of Interfacial Performances on Insulating and Semi-Conducting Silicone Polymer Joint by Plasma-treatment
Ki Taek Lee, | 한국전기전자재료학회 | 2007 ,
222
Internet-based Real-time Obstacle Avoidance of a Mobile Robot
Internet-based Real-time Obstacle Avoidance of a Mobile Robot
Jae-Pyung Ko, Jang-Myung Lee, | 대한기계학회 | 2005 ,
223
On Bare Plural Interpretations
On Bare Plural Interpretations
노은주, | 담화인지언어학회 | 2006 ,
224
Lubrication Effect of Liquid Nitrogen in Cryogenic Machining Friction on the Tool-chip Interface
Lubrication Effect of Liquid Nitrogen in Cryogenic Machining Friction on the Tool-chip Interface
Seong-Chan Jun, | 대한기계학회 | 2005 ,
225
Internetworking with TCP/IP, 3 : Client-Server Programming and Applications
Internetworking with TCP/IP, 3 : Client-Server Programming and Applications
Comer, Douglas E., 005.754-C732i | Prentice-Hall, Inc | 1996 005.754-C732i,
226
The Whole Internet for Windows 95 : User's Guide and Catalog
The Whole Internet for Windows 95 : User's Guide and Catalog
Krol, ED, 005.43-K93w | O'Reilly&Associates, INC | 1995 005.43-K93w,
227
EDI(Electronic Data Interchange) 확산에 영향을 미치는 조직 특성 및 혁신 특성에 관한 연구
EDI(Electronic Data Interchange) 확산에 영향을 미치는 조직 특성 및 혁신 특성에 관한 연구
노영, 325.1-노64e-TM | 한국외국어대학교 대학원 | 1996 325.1-노64e-TM,
228
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Kwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho L, | 한국마이크로전자및 패키징학회 | 2005 ,
229
Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion AU UBM during Aging
Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion AU UBM during Aging
Moon Gi Cho, Hyuck Mo Lee, Seong Woon Booh, Tae-, | 한국마이크로전자및 패키징학회 | 2005 ,
230
Interfacial Electrical/Dielectric Characterization in Low Temperature Polycrystalline Si
Interfacial Electrical/Dielectric Characterization in Low Temperature Polycrystalline Si
Jinha Hwang, | 한국마이크로전자및 패키징학회 | 2005 ,
처음이전18192021222324252627이후마지막
1
1st International Conference
이화여자대학교 국제통상협력연구소 [경제학, ]
2
2000 International Congress on Exercise Nutrition
한국운동영양학회 [생활과학, ]
3
2004 The Costume Culture Association International Conference
복식문화학회 [생활과학, ]
4
2009 International Workshop
전남대학교 아시아태평양지역연구소 [사회과학, ]
5
98 International symposium
한국환경농학회 [농업·농학, ]
6
Acoustical Physics
MAIK Nauka Interperiodica [, ]
7
Advanced Composite Materials
VSP International Science Publishers [, ]
8
Advanced Materials & Processes
ASM International [, ]
9
Advanced Powder Technology
VSP International Science Publishers [, ]
10
Advanced Robotics
VSP International Science Publishers [, ]
11
Advancing the Consumer Interest
American Council on Consumer Interests [, ]
12
Ageing International
Transaction Publishers [, ]
13
Agenda Internacional
Pontificia Universidad Catolica del Peru [, ]
14
Agricultural Engineering International: CIGR Journal
International Commission of Agricultural Engineering [, ]
15
Alternatives: Turkish Journal of International Relations
Department of International Relations at Fatih University [, ]
16
American Foreign Policy Interests
Taylor & Francis Ltd [, ]
17
American History
Primedia Special Interest Publications [, ]
18
American History Illustrated
Primedia Special Interest Publications [, ]
19
American Studies International
American Studies International [, ]
20
America's Civil War
Primedia Special Interest Publications [, ]