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Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Kwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho L, | 한국마이크로전자및 패키징학회 | 2005 ,
12
Improving Stabilty and Characteristics of Circuit and Structure with the Ceramic Process Variable of Dualband Antenna Switch Module
Improving Stabilty and Characteristics of Circuit and Structure with the Ceramic Process Variable of Dualband Antenna Switch Module
Joong-Keun Lee, Joshua Yoo, Myung Jae Yoo, Woo-Wu, | 한국마이크로전자및 패키징학회 | 2005 ,
13
Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion AU UBM during Aging
Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion AU UBM during Aging
Moon Gi Cho, Hyuck Mo Lee, Seong Woon Booh, Tae-, | 한국마이크로전자및 패키징학회 | 2005 ,
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