본문

  1. Home
51 Results:SS:PACK 0.78 sec.
RSS 
Multilingual
 Расширенный поиск
 Новый поиск книги прибытия
Selected Print Select Export to Excel
11
Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages
Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages
K. W. Lee, | 대한금속재료학회 | 2006 ,
12
반도체 Package 공정용 emc gun에 관한 연구
반도체 Package 공정용 emc gun에 관한 연구
조명현, | 대한전자공학회 | 2006 ,
13
Adaptive Cross-Layer Packet Scheduling Method for Multimedia Services in Wireless Personal Area Networks
Adaptive Cross-Layer Packet Scheduling Method for Multimedia Services in Wireless Personal Area Networks
Kim, SungWon, | 한국통신학회 | 2006 ,
14
Effects of Packaging Methods on the Meat Quality of a-Tocopherol Supplemented Broiler Chicks during Refrigerated Storage
Effects of Packaging Methods on the Meat Quality of a-Tocopherol Supplemented Broiler Chicks during Refrigerated Storage
Youn-Chul Ryu, Min-Suk Rhee, Moo-Ha Lee, Sung-Ki, | Korean Societyof Food Science&Technology | 2006 ,
15
신호공단조성공사에서 Pack Drain 공법과 Paper Drain 공법의 비교분석
신호공단조성공사에서 Pack Drain 공법과 Paper Drain 공법의 비교분석
이상구, 532.2-이'52시-TM | 동의대학교 대학원 | 1999 532.2-이'52시-TM,
16
Thermal Transient Characteristics of Die Attach in High Power LED Package
Thermal Transient Characteristics of Die Attach in High Power LED Package
Hyun-Ho Kim, Sang-Hyun Choi, Sang-Hyun Shin, Youn, | 한국마이크로전자및 패키징학회 | 2005 ,
17
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Kwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho L, | 한국마이크로전자및 패키징학회 | 2005 ,
18
Application of the Axiomatic Design Methodology to the Design of PBGA Package with Polyimide Coating Layer
Application of the Axiomatic Design Methodology to the Design of PBGA Package with Polyimide Coating Layer
Ji Hyuck Yang, Kang Yong Lee, C. Y. Dong, | 대한기계학회 | 2004 ,
19
Assessment and Applications of Multi-Degradable Polyethylene Films as Packaging Materials
Assessment and Applications of Multi-Degradable Polyethylene Films as Packaging Materials
Myong-Soo Chung, Sang-Hyun Lee, Young-Sun You, Hy, | Korean Societyof Food Science&Technology | 2006 ,
20
Effect of High Oxygen Modified Atmosphere Packaging on Quality and Marketability of Leaf Lettuce
Effect of High Oxygen Modified Atmosphere Packaging on Quality and Marketability of Leaf Lettuce
Jong Nam Park, Jang Hyn Kyoung, Wie Soo Kang, Che, | 한국원예학회 | 2006 ,
처음이전123456이후마지막
1
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
2
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
3
Advanced Packaging
Penn Well Publishing Co. [, ]
4
Chas Wolff Packing Company v. Court of Industrial Relations of the State of Kansas
Great Neck Publishing [, ]
5
Hewlett-Packard Journal
Hewlett-Packard Co. [, ]