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11
Processing Strategies for Enhanced Resistance to Impact Fracture of Thin Small-Outline Packages
Processing Strategies for Enhanced Resistance to Impact Fracture of Thin Small-Outline Packages
Seong-Min Lee, | 대한금속.재료학회 | 2003 ,
12
Evaluation of Thermal Deformation in Electronic Packages
Evaluation of Thermal Deformation in Electronic Packages
Hyeon Gyu Beom, | 대한기계학회 | 2000 ,
13
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Young Bae Par, Dok Won Lee, | 대한금속.재료학회 | 2001 ,
14
Graphis packaging, 8 : an international compilation of package design, ein internationaler uberblick uber die packungsgestaltung, un repetoire international des formes d'emballage
Graphis packaging, 8 : an international compilation of package design, ein internationaler uberblick uber die packungsgestaltung, un repetoire international des formes d'emballage
Pedersen , B. Martin, 658-P371g | Graphis | 2000 658-P371g,
15
Package design in Japan biennual, 9
Package design in Japan biennual, 9
Japan package design association and rikuyosha,, 658-J35p | Rikuyosha | 2001 658-J35p,
16
CPM 技法에 의한 工事管理 Package Program의 活用度에 관한 比較 硏究
CPM 技法에 의한 工事管理 Package Program의 活用度에 관한 比較 硏究
강병목, 530.965-강44c-TM | 중앙대학교 국제경영대학원 | 1984 530.965-강44c-TM,
17
實驗計劃法의 電算處理方法 : 統計 Package SAS와 SPSS의 比較
實驗計劃法의 電算處理方法 : 統計 Package SAS와 SPSS의 比較
문영길, 310-문64시-TM | 慶星大學校 産業大學院 | 1988 310-문64시-TM,
18
Art Deco Package Collection = ア-ルデコのパシケ-ヅ
Art Deco Package Collection = ア-ルデコのパシケ-ヅ
Katsu Kimura, 639-K19a-R | Rikuyo-sha Publishing | 1986 639-K19a-R,
19
Package Design in Seoul 1993
Package Design in Seoul 1993
서울패키지디자인협회, 326.143-서66p-R | 안국문화 | 1993 326.143-서66p-R,
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