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121
LC Aligning Properties for Homeotropic Alignment of NLC on the SiOх Thin Film as Incident Angle of Electron Beam Evaporation Angle
LC Aligning Properties for Homeotropic Alignment of NLC on the SiOх Thin Film as Incident Angle of Electron Beam Evaporation Angle
Jong-Hwan Kim, | 한국전기전자재료학회 | 2007 ,
122
공정조성 SnPb 솔더 라인의 온도에 따른 Electromigration 확산원소의 In-situ 분석
공정조성 SnPb 솔더 라인의 온도에 따른 Electromigration 확산원소의 In-situ 분석
김오한, 윤민승, 주영창, 박영배, | 한국마이크로전자및 패키징학회 | 2006 ,
123
SnAgCu 솔더 라인의 Electromigration 특성 분석
SnAgCu 솔더 라인의 Electromigration 특성 분석
고민구, 윤민승, 김빛나, 주영창, 김오한, 박영배, | 한국마이크로전자및 패키징학회 | 2005 ,
124
공정조성 SnPb 솔더에 대한 실시간 Electromigration 거동 관찰
공정조성 SnPb 솔더에 대한 실시간 Electromigration 거동 관찰
김오한, 윤민승, 주영창, 박영배, | 한국마이크로전자및 패키징학회 | 2005 ,
125
Study on Charge Transport in Nanoscale Organic Monolayers for Molecular Electronics Using Liquid Phase Electrodes
Study on Charge Transport in Nanoscale Organic Monolayers for Molecular Electronics Using Liquid Phase Electrodes
Jinha Hwang, | 한국마이크로전자및 패키징학회 | 2005 ,
126
Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling
Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling
J. S. Bae, G. H. Chang, J. H. Lee, | 한국마이크로전자및 패키징학회 | 2005 ,
127
Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion AU UBM during Aging
Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion AU UBM during Aging
Moon Gi Cho, Hyuck Mo Lee, Seong Woon Booh, Tae-, | 한국마이크로전자및 패키징학회 | 2005 ,
128
Practical Application of Sn-3.0Ag-0.5Cu Lead Free Solder in Electronic Production
Practical Application of Sn-3.0Ag-0.5Cu Lead Free Solder in Electronic Production
Kyu-Sang Chae, Jae-Sang Min, Ik-Joo Kim, Il-Je Cho, | 한국마이크로전자및 패키징학회 | 2005 ,
129
고집적용 구리배선의 electromigration 및 thermal fatigue 연구
고집적용 구리배선의 electromigration 및 thermal fatigue 연구
김영후, 박영배, Reiner Moning, Cynthia A. Volkert, 주영창, | 한국마이크로전자및 패키징학회 | 2005 ,
130
Recovery of Palladium by an Electrochemical Method in Hydrochloric Acid Solution
Recovery of Palladium by an Electrochemical Method in Hydrochloric Acid Solution
Min-Seuk Kim, Jae-Chun Lee, Won-Baek Kim, Jin-Ki, | 한국암반공학회 | 2003 ,
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