본문

  1. Home
136 Results:AA:PHIL 0.117 sec.
RSS 
다국어입력
 상세검색
 신착검색
선택출력 선택엑셀내보내기
101
Vision-based self-calibration and control of parallel kinematic mechanisms without proprioceptive sensing
Vision-based self-calibration and control of parallel kinematic mechanisms without proprioceptive sensing
Nicolas Andreff, | Springer | 2009 ,
102
Integrated Insurance Design in the Presence of Multiple Medical Technologies
Integrated Insurance Design in the Presence of Multiple Medical Technologies
Goldman, D., | American Economic Assn | 2007 ,
103
Efficient Firm Dynamics in a Frictional Labor Market
Efficient Firm Dynamics in a Frictional Labor Market
Kaas, Leo, | American Economic Assn | 2015 ,
104
Media Influences on Social Outcomes: The Impact of MTV's 16 and Pregnant on Teen Childbearing
Media Influences on Social Outcomes: The Impact of MTV's 16 and Pregnant on Teen Childbearing
Kearney, Melissa S., | American Economic Assn | 2015 ,
105
Development of a Pad Conditioning Method for ILD CMP using a High Pressure Micro Jet System
Development of a Pad Conditioning Method for ILD CMP using a High Pressure Micro Jet System
Hyosang Lee, | 한국전기전자재료학회 | 2008 ,
106
Diamond Conditioner Wear Characterization for a Copper CMP Process
Diamond Conditioner Wear Characterization for a Copper CMP Process
L. Boruckia, | 한국전기전자재료학회 | 2008 ,
107
Study of Inhibition Characteristics of Slurry Additives in Copper CMP using Force Spectroscopy
Study of Inhibition Characteristics of Slurry Additives in Copper CMP using Force Spectroscopy
Hyo Sang Lee, | 한국전기전자재료학회 | 2008 ,
108
Regular Paper : Physics of the Coefficient of Friction in CMP
Regular Paper : Physics of the Coefficient of Friction in CMP
Len Borucki, | 한국전기전자재료학회 | 2008 ,
109
Regular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
Regular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
Hyo Sang Lee, | 한국전기전자재료학회 | 2008 ,
110
Regular Paper : Experimental and Numerical Analysis of A Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization
Regular Paper : Experimental and Numerical Analysis of A Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization
Yun Zhuang, | 한국전기전자재료학회 | 2008 ,
처음이전67891011121314이후마지막
1
African Philosophy
Carfax Publishing Company [, ]
2
Analytic Philosophy
John Wiley & Sons, Inc. [, ]
3
Asian Legal Philosophy
한국법철학회 [법학, ]
4
Asian Philosophy
Carfax Publishing Company [, ]
5
Behavior & Philosophy
Cambridge Center for Behavioral Studies [, ]
6
British Journal for the History of Philosophy
Routledge, Ltd. [, ]
7
Business Review (Federal Reserve Bank of Philadelphia)
Federal Reserve Bank of Philadelphia [, ]
8
Canadian Journal of Philosophy
Department of Philosophy [, ]
9
Chronicle of Philanthropy
Chronicle of Higher Education [, ]
10
Educational Philosophy & Theory
Blackwell Publishing Limited [, ]
11
European Journal of Philosophy
Blackwell Publishing Limited [, ]
12
Forum Philosophicum
Forum Philosophicum [, ]
13
Forum Philosophicum: International Journal for Philosophy
Forum Philosophicum [, ]
14
Haemophilia
Blackwell Publishing Limited [, ]
15
History & Philosophy of Logic
Taylor & Francis Ltd [, ]
16
How I Became a Printer in Philadelphia
Great Neck Publishing [, ]
17
International Journal for Philosophy of Religion
Kluwer Academic Publishers [, ]
18
International Journal of Philosophical Studies
Routledge, Ltd. [, ]
19
International Studies in the Philosophy of Science
Carfax Publishing Company [, ]
20
Journal for General Philosophy of Science
Kluwer Academic Publishers [, ]