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1
Simply packaging : to capture the ever-evolving art of packaging design and reveal its reflection of the times
Simply packaging : to capture the ever-evolving art of packaging design and reveal its reflection of the times
Cheung, Victor, 658-C526s | Viction:ary | 2008 658-C526s,
2
(Design Matters) Packaging 01 : 시장 경쟁력 강화를 위한 필수 입문서
(Design Matters) Packaging 01 : 시장 경쟁력 강화를 위한 필수 입문서
Capsule, 639.5-C254p | 국제 | 2009 639.5-C254p,
3
Packet transport system에 의한 효율적인 IPTV 분배망 구축방안
Packet transport system에 의한 효율적인 IPTV 분배망 구축방안
장진희, | 한국방송공학회 | 2007 ,
4
Excitation Transport by the Resonant Dipole-Dipole Interaction in a Closely Packed Quantum-Dot Film
Excitation Transport by the Resonant Dipole-Dipole Interaction in a Closely Packed Quantum-Dot Film
Suc-kyoung Hong., | 한국물리학회 | 2006 ,
5
Coherent Squeezed-State Representation of Traveling General Gaussian Wave Packets
Coherent Squeezed-State Representation of Traveling General Gaussian Wave Packets
Sang Pyo Kim., | 한국물리학회 | 2006 ,
6
Bouncing Wave Packets in a Two-Dimensional Box and Revivals Without Semiclassical Correspondence
Bouncing Wave Packets in a Two-Dimensional Box and Revivals Without Semiclassical Correspondence
Sang Pyo Kim., | 한국물리학회 | 2006 ,
7
Low Actuation Voltage Capacitive Shunt RF-MEMS Switch Using a Corrugated Bridge with HRS MEMS Package
Low Actuation Voltage Capacitive Shunt RF-MEMS Switch Using a Corrugated Bridge with HRS MEMS Package
Yo-Tak Song., | 한국전자파학회 | 2006 ,
8
Wave Packet for a Charged Particle in an Oscillating Electric Field
Wave Packet for a Charged Particle in an Oscillating Electric Field
Kim, Sang Pyo, | 한국물리학회 | 2006 ,
9
High Frequency Properties of Anisotropic Conductive Films (ACFs) for Flip Chip Package Application
High Frequency Properties of Anisotropic Conductive Films (ACFs) for Flip Chip Package Application
Myung Jin Vim, | 대한금속재료학회 | 2006 ,
10
Review of Electrically Conductive Adhesive Technologies for Electronic Packaging
Review of Electrically Conductive Adhesive Technologies for Electronic Packaging
Myung Jin Yim, | 대한금속재료학회 | 2006 ,
처음123456이후마지막
1
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
2
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
3
Advanced Packaging
Penn Well Publishing Co. [, ]
4
Chas Wolff Packing Company v. Court of Industrial Relations of the State of Kansas
Great Neck Publishing [, ]
5
Hewlett-Packard Journal
Hewlett-Packard Co. [, ]