본문

  1. Home
5 Results:SS:SOLDER 0.46 sec.
RSS 
다국어입력
 상세검색
 신착검색
선택출력 선택엑셀내보내기
1
Influence of Polarization Behaviors on the ECM Characteristics of SnPb Solder Alloys in PCB
Influence of Polarization Behaviors on the ECM Characteristics of SnPb Solder Alloys in PCB
Shin Bok Lee, Young Ran Yoo, Ja-Young Jung, Young, | 한국마이크로전자및 패키징학회 | 2005 ,
2
Effects of Temperature and Mechanical Deformation on the Microhardness of Lead free and Composite Solders
Effects of Temperature and Mechanical Deformation on the Microhardness of Lead free and Composite Solders
Joo Won Lee, Sung K. Kang, Hyuck Mo Lee, | 한국마이크로전자및 패키징학회 | 2005 ,
3
Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion AU UBM during Aging
Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion AU UBM during Aging
Moon Gi Cho, Hyuck Mo Lee, Seong Woon Booh, Tae-, | 한국마이크로전자및 패키징학회 | 2005 ,
4
Practical Application of Sn-3.0Ag-0.5Cu Lead Free Solder in Electronic Production
Practical Application of Sn-3.0Ag-0.5Cu Lead Free Solder in Electronic Production
Kyu-Sang Chae, Jae-Sang Min, Ik-Joo Kim, Il-Je Cho, | 한국마이크로전자및 패키징학회 | 2005 ,
5
Sn-3.5Ag. Sn-3.5Ag-0.7Cu, Sn-3.5Ag-3. 0In-0.5Bi Solder를 이용한 μBGA Solder 접합부의 열피로 수명예측
Sn-3.5Ag. Sn-3.5Ag-0.7Cu, Sn-3.5Ag-3. 0In-0.5Bi Solder를 이용한 μBGA Solder 접합부의 열피로 수명예측
김연성,김형일,김종민,신영의, | 대한용접학회 | 2003 ,
처음1마지막