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1
반도체 Package 공정용 emc gun에 관한 연구
반도체 Package 공정용 emc gun에 관한 연구
조명현, | 대한전자공학회 | 2006 ,
2
Thermal Transient Characteristics of Die Attach in High Power LED Package
Thermal Transient Characteristics of Die Attach in High Power LED Package
Hyun-Ho Kim, Sang-Hyun Choi, Sang-Hyun Shin, Youn, | 한국마이크로전자및 패키징학회 | 2005 ,
3
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Kwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho L, | 한국마이크로전자및 패키징학회 | 2005 ,
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