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1
Packet transport system에 의한 효율적인 IPTV 분배망 구축방안
Packet transport system에 의한 효율적인 IPTV 분배망 구축방안
장진희, | 한국방송공학회 | 2007 ,
2
반도체 Package 공정용 emc gun에 관한 연구
반도체 Package 공정용 emc gun에 관한 연구
조명현, | 대한전자공학회 | 2006 ,
3
Thermal Transient Characteristics of Die Attach in High Power LED Package
Thermal Transient Characteristics of Die Attach in High Power LED Package
Hyun-Ho Kim, Sang-Hyun Choi, Sang-Hyun Shin, Youn, | 한국마이크로전자및 패키징학회 | 2005 ,
4
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Kwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho L, | 한국마이크로전자및 패키징학회 | 2005 ,
5
Effect of High Oxygen Modified Atmosphere Packaging on Quality and Marketability of Leaf Lettuce
Effect of High Oxygen Modified Atmosphere Packaging on Quality and Marketability of Leaf Lettuce
Jong Nam Park, Jang Hyn Kyoung, Wie Soo Kang, Che, | 한국원예학회 | 2006 ,
6
Effect of Active Modified Atmosphere Packaging and Storage Temperature on the Quality of Spinach
Effect of Active Modified Atmosphere Packaging and Storage Temperature on the Quality of Spinach
Jong Nam Park, Jang Hun Kyoung, Cheon Soon Jeong, | 한국원예학회 | 2006 ,
7
Rectangle Packing 방식 기반 NoC 테스트 스케쥴링
Rectangle Packing 방식 기반 NoC 테스트 스케쥴링
안진호, 김근배, 강성호, | 대한전자공학회 | 2006 ,
8
Active Packaging Systems For Preventing Oxidation
Active Packaging Systems For Preventing Oxidation
Kwang Seon Choi, Seok In Hong, Seok Min Son, | 한국산업식품공학회 | 2003 ,
9
Microwave Heating Effect on Mechnacal Properties of Food Packing Films
Microwave Heating Effect on Mechnacal Properties of Food Packing Films
Jun Ho Lee, Eun Ju Seog, Rakesh K. Single, | 한국산업식품공학회 | 2001 ,
10
IEEE 802.17 기반의 Resilient Packet Ring 기술과 표준화 동향
IEEE 802.17 기반의 Resilient Packet Ring 기술과 표준화 동향
이재훈, | 대한전자공학회 | 2005 ,
처음12이후마지막
1
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
2
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
3
Advanced Packaging
Penn Well Publishing Co. [, ]
4
Chas Wolff Packing Company v. Court of Industrial Relations of the State of Kansas
Great Neck Publishing [, ]
5
Hewlett-Packard Journal
Hewlett-Packard Co. [, ]