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Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Kwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho L, | 한국마이크로전자및 패키징학회 | 2005 ,
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Using Minimal Path Sets for the Evaluation of the Reliability of DRDT Interconnection Networks
Using Minimal Path Sets for the Evaluation of the Reliability of DRDT Interconnection Networks
임재학, 이종형, 조병엽, | 한국품질경영학회 | 2000 ,
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Journal of Interconnection Networks
World Scientific Publishing Company [, ]