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1
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Kwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho L, | 한국마이크로전자및 패키징학회 | 2005 ,
2
(국도7호선)남북연결도로 건설지 = National highway line 1 South-North Korea inter-connection project
(국도7호선)남북연결도로 건설지 = National highway line 1 South-North Korea inter-connection project
건설교통부 서울지방국토관리청., 534.1-건53나-R | 서울지방국토관리청 | 2004 534.1-건53나-R,
3
Using Minimal Path Sets for the Evaluation of the Reliability of DRDT Interconnection Networks
Using Minimal Path Sets for the Evaluation of the Reliability of DRDT Interconnection Networks
임재학, 이종형, 조병엽, | 한국품질경영학회 | 2000 ,
4
(국도1호선) 남북연결도로 건설지 = National highway line 1 South-North Korea inter-connection project
(국도1호선) 남북연결도로 건설지 = National highway line 1 South-North Korea inter-connection project
건설교통부 서울지방국토관리청., 534.1-건5323나-R | 서울지방국토관리청 | 2003 534.1-건5323나-R,
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1
Journal of Interconnection Networks
World Scientific Publishing Company [, ]