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1
Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads
Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads
Young Kun Jee, | 대한금속재료학회 | 2006 ,
2
Effects of Bismuth on Growth Kinetics of Intermetallic Compounds in Sn-3.5Ag Solder Joints : AGrowth Kinetic Model
Effects of Bismuth on Growth Kinetics of Intermetallic Compounds in Sn-3.5Ag Solder Joints : AGrowth Kinetic Model
Joo-Youl Huh, Sang-Uk Han, Chang-Yong Park, | 대한금속.재료학회 | 2004 ,
3
Reaction Diffusions of Cu6Sn5 and Cu₃Sn Intermetallic Compound in the Couple of Sn-3.5Ag Eutectic Solder and Copper Substrate
Reaction Diffusions of Cu6Sn5 and Cu₃Sn Intermetallic Compound in the Couple of Sn-3.5Ag Eutectic Solder and Copper Substrate
Jeong-Won Yoon,Chang-Bae Lee, | 대한금속.재료학회 | 2003 ,
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