본문

  1. Home
44 Results:SS:PAC 0.78 sec.
RSS 
Multilingual
 Расширенный поиск
 Новый поиск книги прибытия
Selected Print Select Export to Excel
1
Simply packaging : to capture the ever-evolving art of packaging design and reveal its reflection of the times
Simply packaging : to capture the ever-evolving art of packaging design and reveal its reflection of the times
Cheung, Victor, 658-C526s | Viction:ary | 2008 658-C526s,
2
The Influence of Aerosol Source Region on Size-resolved Hygroscopicity During the Asian Pacific Regional Aerosol Characterization Experiment(ACE-Asia) Campaign
The Influence of Aerosol Source Region on Size-resolved Hygroscopicity During the Asian Pacific Regional Aerosol Characterization Experiment(ACE-Asia) Campaign
YongSeob Lee, | 한국대기환경학회 | 2006 ,
3
Excitation Transport by the Resonant Dipole-Dipole Interaction in a Closely Packed Quantum-Dot Film
Excitation Transport by the Resonant Dipole-Dipole Interaction in a Closely Packed Quantum-Dot Film
Suc-kyoung Hong., | 한국물리학회 | 2006 ,
4
Coherent Squeezed-State Representation of Traveling General Gaussian Wave Packets
Coherent Squeezed-State Representation of Traveling General Gaussian Wave Packets
Sang Pyo Kim., | 한국물리학회 | 2006 ,
5
Bouncing Wave Packets in a Two-Dimensional Box and Revivals Without Semiclassical Correspondence
Bouncing Wave Packets in a Two-Dimensional Box and Revivals Without Semiclassical Correspondence
Sang Pyo Kim., | 한국물리학회 | 2006 ,
6
Low Actuation Voltage Capacitive Shunt RF-MEMS Switch Using a Corrugated Bridge with HRS MEMS Package
Low Actuation Voltage Capacitive Shunt RF-MEMS Switch Using a Corrugated Bridge with HRS MEMS Package
Yo-Tak Song., | 한국전자파학회 | 2006 ,
7
Wave Packet for a Charged Particle in an Oscillating Electric Field
Wave Packet for a Charged Particle in an Oscillating Electric Field
Kim, Sang Pyo, | 한국물리학회 | 2006 ,
8
High Frequency Properties of Anisotropic Conductive Films (ACFs) for Flip Chip Package Application
High Frequency Properties of Anisotropic Conductive Films (ACFs) for Flip Chip Package Application
Myung Jin Vim, | 대한금속재료학회 | 2006 ,
9
Review of Electrically Conductive Adhesive Technologies for Electronic Packaging
Review of Electrically Conductive Adhesive Technologies for Electronic Packaging
Myung Jin Yim, | 대한금속재료학회 | 2006 ,
10
Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages
Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages
K. W. Lee, | 대한금속재료학회 | 2006 ,
처음12345이후마지막
1
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
2
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
3
Advanced Packaging
Penn Well Publishing Co. [, ]
4
Aerospace Power Journal
Superintendent of Documents [, ]
5
Air & Space Power Journal
Superintendent of Documents [, ]
6
Asian Perspectives: Journal of Archeology for Asia & the Pacific
University of Hawaii Press [, ]
7
Asia-Pacific Conference on Communications
한국통신학회 [공학, ]
8
Asia-Pacific Conference on Communications
한국통신학회 [, ]
9
Asia Pacific Family Medicine
Blackwell Publishing Limited [, ]
10
AsiaPacific Issues
East-West Center [, ]
11
Asia-Pacific Journal of Atmospheric Sciences
한국기상학회 [자연과학, ]
12
Asia-Pacific Journal of Atmospheric Sciences
한국기상학회 [, ]
13
Asia-Pacific Journal of Business & Commerce
전북대학교 산업경제연구소 [경제·경영, ]
14
Asia-Pacific Journal of Business & Commerce 아태경상저널
전북대학교 산업경제연구소 [, ]
15
Asia-Pacific Journal of EU Studies
한국EU학회 [경제학, ]
16
Asia-Pacific Journal of Intellectual Disabilities (APJID)
대구대학교 한국특수교육문제연구소 [교육학, ]
17
Asia-Pacific Journal of Marine Science & Education
Asia-Pacific Journal of Marine Science & Education [, ]
18
Asia-Pacific journal of research in early childhood education
환태평양유아교육연구학회 [, ]
19
Asia-Pacific journal of research in early childhood education
환태평양유아교육연구학회 [유아교육학, ]
20
Asia-Pacific Journal of Teacher Education
Carfax Publishing Company [, ]