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1
Bonding Structure and Electrical Properties of SiOC(-H) Films Deposited with a Methyltrimethoxysilane Precursor by Using Inductively Coupled Plasma Chemical Vapor Deposition
Bonding Structure and Electrical Properties of SiOC(-H) Films Deposited with a Methyltrimethoxysilane Precursor by Using Inductively Coupled Plasma Chemical Vapor Deposition
Kannan Meera., | 한국물리학회 | 2006 ,
2
Direct Bonding of Silicon Pairs with Heterogeneous Insulator Using Different Annealing Methods
Direct Bonding of Silicon Pairs with Heterogeneous Insulator Using Different Annealing Methods
Ohsung Song, Kiyung Lee, C. S. Yoon, and C. K. Kim, | 대한금속.재료학회 | 2004 ,
3
Fabrication of SOI Structures with Buried Cavities Using Si Wafer Direct Bonding and Electrochemical Etch-stop
Fabrication of SOI Structures with Buried Cavities Using Si Wafer Direct Bonding and Electrochemical Etch-stop
Gwiy-Sang Chung, | 대한금속.재료학회 | 2003 ,
4
Effects of Fiber Aspect Ratio,Fiber Content,and Bonding Agent on Tensile and tear Properties of Short-Fiber reinforced Rubber
Effects of Fiber Aspect Ratio,Fiber Content,and Bonding Agent on Tensile and tear Properties of Short-Fiber reinforced Rubber
Sang-Ryeoul Ryu,Dong-Joo Lee, | 대한기계학회 | 2001 ,
5
Development of Insert Metal For Transient Liquid Phase Bonding of Fe-Base Geat Resistant Alloy
Development of Insert Metal For Transient Liquid Phase Bonding of Fe-Base Geat Resistant Alloy
Byong-Ho Rhee,Dae-Up Kim, | 대한금속.재료학회 | 2002 ,
6
Bonding Phenomena of Transient Liquid Phase Bonded Joints of a Ni Base Single Crystal Superalloy
Bonding Phenomena of Transient Liquid Phase Bonded Joints of a Ni Base Single Crystal Superalloy
Dae-Up Kim,Kazutohi Nishimoto, | 대한금속.재료학회 | 2002 ,
7
Bonding Strength in Structural Adhesive Bonded Joint
Bonding Strength in Structural Adhesive Bonded Joint
Jun Hee Song,Jae Kyoo Lim, | 대한금속.재료학회 | 2001 ,
8
Electronic Structure and Chemical Bonding of Zirconium Disulfide
Electronic Structure and Chemical Bonding of Zirconium Disulfide
Yang-Soo Kim,Hyun-Chul Ko,Hwa-Soo Park, | 대한금속.재료학회 | 2000 ,
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