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1
Media/society : industries, images, and audiences : David Croteau , William Hoynes.
Media/society : industries, images, and audiences : David Croteau , William Hoynes.
Croteau, David., 331.541-C951m-안진홍 | Pine Forge Press | 2000 331.541-C951m-안진홍,
2
Designing Better Schools: The Meaning and Measure of Enabling School Structures
Designing Better Schools: The Meaning and Measure of Enabling School Structures
Hoy, W. K., | Corwin Press Inc. | 2001 ,
3
Toward an Organizational Model of Achievement in High Schools: The Significance of Collective Efficacy
Toward an Organizational Model of Achievement in High Schools: The Significance of Collective Efficacy
Hoy, W. K., | Corwin Press Inc. | 2002 ,
4
Consumption Responses to In-Kind Transfers: Evidence from the Introduction of the Food Stamp Program
Consumption Responses to In-Kind Transfers: Evidence from the Introduction of the Food Stamp Program
Hoynes, H.W., | american economic association | 2009 ,
5
Alteration of contraction-to-rest ratio to optimize trabecular bone adaptation induced by dynamic muscle stimulation
Alteration of contraction-to-rest ratio to optimize trabecular bone adaptation induced by dynamic muscle stimulation
Hoyan Lam,, | Elsevier Inc | 2011 ,
6
Income, the Earned Income Tax Credit, and Infant Health
Income, the Earned Income Tax Credit, and Infant Health
Hilary Hoynes,, | american economic association | 2015 ,
7
History and the Sizes of Cities
History and the Sizes of Cities
Hoyt Bleakley, | American Economic Assn | 2015 ,
8
Determination of Self-Incompatibility Genotypes of Korean Apple Cultivars Based on S-RNase PCR
Determination of Self-Incompatibility Genotypes of Korean Apple Cultivars Based on S-RNase PCR
Hoy Taek Kim, | 한국식물학회(Adventitous Root Formation | 2006 ,
9
Regular Paper : Phase Stability of Bi-2212 and Bi-2223 Thin Films Prepared by IBS Technique
Regular Paper : Phase Stability of Bi-2212 and Bi-2223 Thin Films Prepared by IBS Technique
Sung Ho Yang, | 한국전기전자재료학회 | 2002 ,
10
Improvement of Adhesion strength between Cu-based Leadframe and Epoxy Molding Compound
Improvement of Adhesion strength between Cu-based Leadframe and Epoxy Molding Compound
Ho Young Lee, | 한국전기전자재료학회 | 2001 ,
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