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1
A Study on the Corrosion Effects by Addition of Complexing Agent in the Copper CMP Process
A Study on the Corrosion Effects by Addition of Complexing Agent in the Copper CMP Process
Sang Yong Kim, | 한국전기전자재료학회 | 2004 ,
2
Roles of Phosphoric Acid in Slurry for Cu and TaN CMP
Roles of Phosphoric Acid in Slurry for Cu and TaN CMP
Sang Yong Kim, | 한국전기전자재료학회 | 2004 ,
3
Failure Analysis for High via Resistance by HDP CVD System for IMD Layer
Failure Analysis for High via Resistance by HDP CVD System for IMD Layer
Sang Yong Kim, | 한국전기전자재료학회 | 2003 ,
4
Reduction of Plasma Process Induced Damage during HDP IMD Deposition
Reduction of Plasma Process Induced Damage during HDP IMD Deposition
Sang Yong Kim, | 한국전기전자재료학회 | 2003 ,
5
A Study on Characterization and Modeling of Shallow Trench Isolation in Oxide Chemical Mechanical Polishing
A Study on Characterization and Modeling of Shallow Trench Isolation in Oxide Chemical Mechanical Polishing
Sang Yong Kim, | 한국전기전자재료학회 | 2002 ,
6
Isolation of Antimicrobial Substances from Natural Products and Their Preservative Effect
Isolation of Antimicrobial Substances from Natural Products and Their Preservative Effect
Hee-Yun Kim, | 한국식품과학회 | 2001 ,
7
Regional Differences of Four Major Rice Cultivars in Korea by Capillary Electrophoresis
Regional Differences of Four Major Rice Cultivars in Korea by Capillary Electrophoresis
Mee-Ra Rhyu, | 한국식품과학회 | 2001 ,
8
Probabilistic solution to stochastic infiltrated flow equation
Probabilistic solution to stochastic infiltrated flow equation
Sangdan Kim,, | 대한토목학회 | 2004 ,
9
Optimization of Removal Rates with Guaranteed Dispersion Stability in Copper CMP Slurry
Optimization of Removal Rates with Guaranteed Dispersion Stability in Copper CMP Slurry
Tae Gun Kim, | 한국전기전자재료학회 | 2005 ,
10
Experiment of Drifting Mobilities of Holes and Electrons in Stabilized a-Se Film
Experiment of Drifting Mobilities of Holes and Electrons in Stabilized a-Se Film
Sang Sik Kang, | 한국전기전자재료학회 | 2004 ,
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