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1
Review of Electrically Conductive Adhesive Technologies for Electronic Packaging
Review of Electrically Conductive Adhesive Technologies for Electronic Packaging
Myung Jin Yim, | 대한금속재료학회 | 2006 ,
2
Effects of Packaging Methods on the Meat Quality of a-Tocopherol Supplemented Broiler Chicks during Refrigerated Storage
Effects of Packaging Methods on the Meat Quality of a-Tocopherol Supplemented Broiler Chicks during Refrigerated Storage
Youn-Chul Ryu, Min-Suk Rhee, Moo-Ha Lee, Sung-Ki, | Korean Societyof Food Science&Technology | 2006 ,
3
Assessment and Applications of Multi-Degradable Polyethylene Films as Packaging Materials
Assessment and Applications of Multi-Degradable Polyethylene Films as Packaging Materials
Myong-Soo Chung, Sang-Hyun Lee, Young-Sun You, Hy, | Korean Societyof Food Science&Technology | 2006 ,
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1
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
2
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
3
Advanced Packaging
Penn Well Publishing Co. [, ]