본문

  1. Home
3 Results:SS:SOLDER 0.46 sec.
RSS 
Multilingual
 Расширенный поиск
 Новый поиск книги прибытия
Selected Print Select Export to Excel
1
Dissolution of Cu Into Sn-Bases Solders during Reflow Slldering
Dissolution of Cu Into Sn-Bases Solders during Reflow Slldering
Jong-Hyun Lee,Dong-Hyuk Shin,Yong-Seog Kim, | 대한금속.재료학회 | 2003 ,
2
Shear Strength and Aging Characteristics of 63Sn-37Pb Solder Bumps with Various Solder Ball and Pad Sized
Shear Strength and Aging Characteristics of 63Sn-37Pb Solder Bumps with Various Solder Ball and Pad Sized
Jin-Won Choi,Ho-Seob Cha, | 대한금속.재료학회 | 2003 ,
3
Reaction Diffusions of Cu6Sn5 and Cu₃Sn Intermetallic Compound in the Couple of Sn-3.5Ag Eutectic Solder and Copper Substrate
Reaction Diffusions of Cu6Sn5 and Cu₃Sn Intermetallic Compound in the Couple of Sn-3.5Ag Eutectic Solder and Copper Substrate
Jeong-Won Yoon,Chang-Bae Lee, | 대한금속.재료학회 | 2003 ,
처음1마지막