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811
Regular Paper : A New SOI LIGBT Structure with Improved Latch - Up Performance
Regular Paper : A New SOI LIGBT Structure with Improved Latch - Up Performance
Woong Je Sung, | 한국전기전자재료학회 | 2002 ,
812
Regular Paper : Surface Treatment of Polymer Materials and Transparent Conductive Films
Regular Paper : Surface Treatment of Polymer Materials and Transparent Conductive Films
Bong Ju Lee, | 한국전기전자재료학회 | 2002 ,
813
The Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling
The Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling
Seong Min Lee, | 한국전기전자재료학회 | 2002 ,
814
Effect of Impurities on Stress Induced Void Formation in A1 - 1%Si Conductors
Effect of Impurities on Stress Induced Void Formation in A1 - 1%Si Conductors
Seong Min Lee, | 한국전기전자재료학회 | 2002 ,
815
Regular Paper : The Effect of Pyrazine on TMAH : IPA Single - crystal Silicon Anisotropic Etching Properties
Regular Paper : The Effect of Pyrazine on TMAH : IPA Single - crystal Silicon Anisotropic Etching Properties
Gwiy Sang Chung, | 한국전기전자재료학회 | 2002 ,
816
Electrical Properties and Temperature Effects of PET Films with Interface Layers
Electrical Properties and Temperature Effects of PET Films with Interface Layers
Dong Shick Kim, | 한국전기전자재료학회 | 2001 ,
817
ITO Thin Film Ablation Using KrF Excimer Laser and its Characteristics
ITO Thin Film Ablation Using KrF Excimer Laser and its Characteristics
Kyoung Cheol Lee, | 한국전기전자재료학회 | 2001 ,
818
MgF2 / CeO2 AR Coating on p - type ( 100 ) Cz Silicon Solar Cells
MgF2 / CeO2 AR Coating on p - type ( 100 ) Cz Silicon Solar Cells
D . G . Lim, | 한국전기전자재료학회 | 2001 ,
819
Epitaxial Growth of BSCCO Type Structure in Atomic Layer by Layer Deposition by Ion Beam Sputtering
Epitaxial Growth of BSCCO Type Structure in Atomic Layer by Layer Deposition by Ion Beam Sputtering
Hee Kab Lee, | 한국전기전자재료학회 | 2001 ,
820
Improvement of Adhesion strength between Cu-based Leadframe and Epoxy Molding Compound
Improvement of Adhesion strength between Cu-based Leadframe and Epoxy Molding Compound
Ho Young Lee, | 한국전기전자재료학회 | 2001 ,
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