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791
A Study on Performance Analysis of the Helically Coiled Evaporator with Circular Minichannels
A Study on Performance Analysis of the Helically Coiled Evaporator with Circular Minichannels
Ju Won Kim., | 대한기계학회 | 2006 ,
792
Application of Immersed Boundary Method for Flow Over Stationary and Oscillating Cylinders
Application of Immersed Boundary Method for Flow Over Stationary and Oscillating Cylinders
Dae Sung Lee., | 대한기계학회 | 2006 ,
793
The Application of CBR for Improving Forecasting Performance of Periodic Expenditures
The Application of CBR for Improving Forecasting Performance of Periodic Expenditures
June Seong Yi., | 대한건축학회 | 2006 ,
794
A Pseudo Multiple Capture CMOS Image Sensor with RWB Color Filter Array
A Pseudo Multiple Capture CMOS Image Sensor with RWB Color Filter Array
Juseop Park., | 대한전자공학회 | 2006 ,
795
An Implementation Method of Cycle Accurate Simulator for the Design of a Pipelined DSP
An Implementation Method of Cycle Accurate Simulator for the Design of a Pipelined DSP
Hyeong Bae Park., | 대한전자공학회 | 2006 ,
796
Beyond-CMOS : Impact of Side-Recess Spacing on the Logic Performance of 50 nm In0.7Ga0.3As HEMTs
Beyond-CMOS : Impact of Side-Recess Spacing on the Logic Performance of 50 nm In0.7Ga0.3As HEMTs
Dae-Hyun Kim., | 대한전자공학회 | 2006 ,
797
Hydrogen Ion Implantation Mechanism in GaAs-on-insulator Wafer Fomation by Ion-cut Process
Hydrogen Ion Implantation Mechanism in GaAs-on-insulator Wafer Fomation by Ion-cut Process
Hyung-Joo Woo., | 대한전자공학회 | 2006 ,
798
Color STN(CSTN)LCD Driver Imtegrated Circuit with Sense Amplifier of Non-Volatile Memory
Color STN(CSTN)LCD Driver Imtegrated Circuit with Sense Amplifier of Non-Volatile Memory
Chang-Hee Shin., | 대한전자공학회 | 2006 ,
799
Improvement of Leakage Current Property of TIT Capacitor with Compositionally Stepped HfxAlyOz Thin Films
Improvement of Leakage Current Property of TIT Capacitor with Compositionally Stepped HfxAlyOz Thin Films
Deok Sin Kil, | 대한금속재료학회 | 2006 ,
800
Heat Effect and Impact Resistance during Electromigration on Cu-Sn Interconnections
Heat Effect and Impact Resistance during Electromigration on Cu-Sn Interconnections
Tae Kyu Lee, | 대한금속재료학회 | 2006 ,
처음이전75767778798081828384이후마지막
1
Ethiopian Journal of Health Sciences
Jimma University [, ]