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21
Analysis of Ring Pack Lubricatoin
Analysis of Ring Pack Lubricatoin
Jae-Seon Lee,Dong-Chul Han, | 대한기계학회 | 2000 ,
22
Evaluation of Thermal Deformation in Electronic Packages
Evaluation of Thermal Deformation in Electronic Packages
Hyeon Gyu Beom, | 대한기계학회 | 2000 ,
23
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Young Bae Par, Dok Won Lee, | 대한금속.재료학회 | 2001 ,
24
Graphis packaging, 8 : an international compilation of package design, ein internationaler uberblick uber die packungsgestaltung, un repetoire international des formes d'emballage
Graphis packaging, 8 : an international compilation of package design, ein internationaler uberblick uber die packungsgestaltung, un repetoire international des formes d'emballage
Pedersen , B. Martin, 658-P371g | Graphis | 2000 658-P371g,
25
The packaging designer's book of patterns
The packaging designer's book of patterns
Roth , Laszlo, 326.12-R845p | John Wiley | 2000 326.12-R845p,
26
A tutorial guide to Mechanical desktop 5/ Power pack : an ntroduction to modeling for engineering design
A tutorial guide to Mechanical desktop 5/ Power pack : an ntroduction to modeling for engineering design
Lockhart , Shawna D., 530.3-L816t | Prentice Hall | 2001 530.3-L816t,
27
The Earth Pack : Tornadoes, Earthquakes, Volcanoes, Nature's Forces in Three Dimensions
The Earth Pack : Tornadoes, Earthquakes, Volcanoes, Nature's Forces in Three Dimensions
van der Meer, Ron, 451.1-V111e-R | National Geograph Society | 1995 451.1-V111e-R,
28
Compact CD Disc Packaging and Graphics = CD ぺッケジ & グラィックス
Compact CD Disc Packaging and Graphics = CD ぺッケジ & グラィックス
Pfeifer, Ken, 658.3-P525c-R | Rockport | 1992 658.3-P525c-R,
29
Cisco switching black book
Cisco switching black book
Odom, Sean., 005.71-O25c | Coriolis Group Books | 2001 005.71-O25c,
30
Physical architecture of VLSI systems
Physical architecture of VLSI systems
Hannemann, Rob, 005.12-H244p | Wiley | 1994 005.12-H244p,
처음이전123마지막
1
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
2
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
3
Advanced Packaging
Penn Well Publishing Co. [, ]
4
Chas Wolff Packing Company v. Court of Industrial Relations of the State of Kansas
Great Neck Publishing [, ]
5
Hewlett-Packard Journal
Hewlett-Packard Co. [, ]