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241
Second Order Bounce Back Boundary Condition for the Latice Boltzmann Fluid Simulation
Second Order Bounce Back Boundary Condition for the Latice Boltzmann Fluid Simulation
In Chan Kim, | 대한기계학회 | 2000 ,
242
Dielectric Properties of Ta₂O5 Thin Films Deposited onto Ti and TiO₂Layer
Dielectric Properties of Ta₂O5 Thin Films Deposited onto Ti and TiO₂Layer
In Sung Kim,Soon Jong Jeong,Jae Sung Song, | 대한금속.재료학회 | 2002 ,
243
Deformation Mechanisms of Pure Ti Duting Equal Channel Angular Pressing
Deformation Mechanisms of Pure Ti Duting Equal Channel Angular Pressing
Dong Hyuk Shin,InyoungKim,Jongryoul Kim, | 대한금속.재료학회 | 2002 ,
244
Effects of Change in Growth Mechanism Due To Yttrium-Addition in Adhesion of Alumina Scale Formed on Fe₃Al Alloy: Countercurrent Diffusion Modification Model
Effects of Change in Growth Mechanism Due To Yttrium-Addition in Adhesion of Alumina Scale Formed on Fe₃Al Alloy: Countercurrent Diffusion Modification Model
Insoo Kim, | 대한금속.재료학회 | 2001 ,
245
The Effects of KCI and KF Addition to KOH Electrolyte on the Electrochemical Characteristics of MG₂Ni Electrode
The Effects of KCI and KF Addition to KOH Electrolyte on the Electrochemical Characteristics of MG₂Ni Electrode
Kwan-Suk Yun,Won-Sub Chung,In-Gon Kim, | 대한금속.재료학회 | 2001 ,
246
Unified Viscoplatic Models of Low Cycle Fatugue Behavior of Waspaloy
Unified Viscoplatic Models of Low Cycle Fatugue Behavior of Waspaloy
Jong-Taek Yeom,S.J.Williams,In-Soo Kim, | 대한금속.재료학회 | 2001 ,
247
High Temperature Charging Efficiency and Degradation Behavior of High Capacity Ni-Mh Batteries
High Temperature Charging Efficiency and Degradation Behavior of High Capacity Ni-Mh Batteries
Jeon Cho and In Joong Kim, | 대한금속.재료학회 | 2001 ,
248
Effects of δ Phase and Cold Drawing Ratio on the LCF Properties of Alloy 718 Wire
Effects of δ Phase and Cold Drawing Ratio on the LCF Properties of Alloy 718 Wire
Yong-Kwon Jeong,Chan-Yong Jo,In-Bae Kim, | 대한금속.재료학회 | 2000 ,
249
Characterization of Deformation Behavior For Waspaloy Under Crepp-Fatigue Interaction
Characterization of Deformation Behavior For Waspaloy Under Crepp-Fatigue Interaction
In-Soo Kim, Trevor A. Brown, Jong-Taek Yeom, | 대한금속.재료학회 | 2000 ,
250
Microstructural Evolution of DS CM186LC During Creep and Thermal Exposure
Microstructural Evolution of DS CM186LC During Creep and Thermal Exposure
Chang-Yong Jo,Doo-Hyun Kim,Seong-Moon Seo, In-Soo, | 대한금속.재료학회 | 2000 ,
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