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Microstructural Evolution of DS CM186LC During Creep and Thermal Exposure
Microstructural Evolution of DS CM186LC During Creep and Thermal Exposure
Detailed Information
MARC
008000104s2000 ULKa a ENG■022 ▼a12259438
■245 ▼aMicrostructural Evolution of DS CM186LC During Creep and Thermal Exposure▼d공저 Chang-Yong Jo,Doo-Hyun Kim,Seong-Moon Seo, In-Soo Kim
■260 ▼a서울▼b대한금속.재료학회▼c2000.
■300 ▼app. 111-116
■653 ▼aMICROSTRUCTURAL▼aEVOLUTION▼aCM186LC▼aCREEP▼aTHERMAL▼aEXPOSURE
■700 ▼aChang-Yong Jo,Doo-Hyun Kim,Seong-Moon Seo, In-Soo Kim
■773 ▼tMetals and Materials▼gVOL.6 NO.2 (2000 APRIL)▼d2000, 04
■SIS ▼aS009179▼b60013551▼h8▼s2


