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11
Effects of Packaging Methods on the Meat Quality of a-Tocopherol Supplemented Broiler Chicks during Refrigerated Storage
Effects of Packaging Methods on the Meat Quality of a-Tocopherol Supplemented Broiler Chicks during Refrigerated Storage
Youn-Chul Ryu, Min-Suk Rhee, Moo-Ha Lee, Sung-Ki, | Korean Societyof Food Science&Technology | 2006 ,
12
Application of the Axiomatic Design Methodology to the Design of PBGA Package with Polyimide Coating Layer
Application of the Axiomatic Design Methodology to the Design of PBGA Package with Polyimide Coating Layer
Ji Hyuck Yang, Kang Yong Lee, C. Y. Dong, | 대한기계학회 | 2004 ,
13
Assessment and Applications of Multi-Degradable Polyethylene Films as Packaging Materials
Assessment and Applications of Multi-Degradable Polyethylene Films as Packaging Materials
Myong-Soo Chung, Sang-Hyun Lee, Young-Sun You, Hy, | Korean Societyof Food Science&Technology | 2006 ,
14
Non-Destructive Evaluation of Semiconductor Package by Electronic Speckle Pattern Interferometry
Non-Destructive Evaluation of Semiconductor Package by Electronic Speckle Pattern Interferometry
Koungsuk Kim, Kisoo Kang, Seungtack Jung, | 대한기계학회 | 2005 ,
15
Effect of Packing Size on Chomatographic Separation of Cetechin Compounds in Green Tea
Effect of Packing Size on Chomatographic Separation of Cetechin Compounds in Green Tea
Ji Hoon Kang, Seung Bum Hong, Jung Il Kim, Sung T, | 한국화학공학회 | 2000 ,
16
Thermomechanical Stability of Memory Package with LOC Structure
Thermomechanical Stability of Memory Package with LOC Structure
Seong-Min Lee, | Metals and Materials | 2005 ,
17
Mechanical Strength Test Method for Solder Ball Joint in BGA Package
Mechanical Strength Test Method for Solder Ball Joint in BGA Package
Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung, | Metals and Materials | 2005 ,
18
Antioxidant-impregnated Food Packaging Materials for Inhibition of Lipid Oxidation
Antioxidant-impregnated Food Packaging Materials for Inhibition of Lipid Oxidation
Han-Seung Shin, Younsuk Lee, | Korean Societyof Food Science&Technology | 2003 ,
19
Processing Strategies for Enhanced Resistance to Impact Fracture of Thin Small-Outline Packages
Processing Strategies for Enhanced Resistance to Impact Fracture of Thin Small-Outline Packages
Seong-Min Lee, | 대한금속.재료학회 | 2003 ,
20
Friction Characteristics of Piston Ring Pack with Consideration of Mixed Lubrication : Parametric Investigation
Friction Characteristics of Piston Ring Pack with Consideration of Mixed Lubrication : Parametric Investigation
Kim Ji-Young,Kim Jee-Woon,Cho Myung-Rae,Han Dong-, | 대한기계학회 | 2002 ,
처음이전123이후마지막
1
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
2
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
3
Advanced Packaging
Penn Well Publishing Co. [, ]
4
Chas Wolff Packing Company v. Court of Industrial Relations of the State of Kansas
Great Neck Publishing [, ]
5
Hewlett-Packard Journal
Hewlett-Packard Co. [, ]