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11
Electrical Characteristics of CMOS Corcuit Due to Channel Region Parameters in LDMOSFET
Electrical Characteristics of CMOS Corcuit Due to Channel Region Parameters in LDMOSFET
Nam-Soo Kim, | 한국전기전자재료학회 | 2006 ,
12
Advanced Pad Conditioner Design for Exide/Metal CMP
Advanced Pad Conditioner Design for Exide/Metal CMP
Taewook Hwang, | 한국전기전자재료학회 | 2006 ,
13
VLSI Design of CMOS shared scalable buffer switch for gigabit ATM switching network
VLSI Design of CMOS shared scalable buffer switch for gigabit ATM switching network
정갑중, 567-정12v-TD | 연세대학교 대학원 | 1998 567-정12v-TD,
14
(CMOS) Digital integrated circuits : analysis and design
(CMOS) Digital integrated circuits : analysis and design
Kang, Sung Mo, 569.8-K16d | McGraw-Hill | 1996 569.8-K16d,
15
A-High Density 64k-Bit One-Time Programmable ROM Array with 3-Transistor Cell Standard CMOS Gate-Oxide Antifuse
A-High Density 64k-Bit One-Time Programmable ROM Array with 3-Transistor Cell Standard CMOS Gate-Oxide Antifuse
Hyouk-Kyu Cha, Jinbong Kim, Kwyro Lee, | 대한전자공학회 | 2004 ,
16
Accurate Extraction of Crosstalk Induced Dynamic Variation of Coupling Capacitance for Interconnect Lines of CMOSFETs
Accurate Extraction of Crosstalk Induced Dynamic Variation of Coupling Capacitance for Interconnect Lines of CMOSFETs
Yong Goo-Kim, Hee-Hwan Ji, Hyung Sun Yoon, Sung H, | 대한전자공학회 | 2004 ,
17
A High Swing Range, High Bandwidth CMOS PGA and ADC for IF QPSK Receiver Using 1.8V Supply
A High Swing Range, High Bandwidth CMOS PGA and ADC for IF QPSK Receiver Using 1.8V Supply
Woo Yol Lee, Jong Chul Lim, Hee Won Park, Kuk Tae, | 대한전자공학회 | 2005 ,
18
Application of CMAC to Structural Model Identification
Application of CMAC to Structural Model Identification
Dong-Hyawn Kim,Byoung-Wan Kim,In-Won Lee, | 대한토목학회 | 2000 ,
19
Numerical Modeling for Cmbustion and Soot Formation Processes in Turbulent Diffusion Flames
Numerical Modeling for Cmbustion and Soot Formation Processes in Turbulent Diffusion Flames
Hoo-Joon Kim,Yong-Mo Kim, | 대한기계학회 | 2002 ,
20
Microstructural Evolution of DS CM186LC During Creep and Thermal Exposure
Microstructural Evolution of DS CM186LC During Creep and Thermal Exposure
Chang-Yong Jo,Doo-Hyun Kim,Seong-Moon Seo, In-Soo, | 대한금속.재료학회 | 2000 ,
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