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161
Surface Analysis of Plasma-treated PDMS by XPS and Surface Voltage Decay
Surface Analysis of Plasma-treated PDMS by XPS and Surface Voltage Decay
Bok Hee Youn, | 한국전기전자재료학회 | 2003 ,
162
Reproducible Chemical Mechanical Polishing Characteristics of Shallow Trench Isolation Structure using High Selectivity Slurry
Reproducible Chemical Mechanical Polishing Characteristics of Shallow Trench Isolation Structure using High Selectivity Slurry
So Young Jeong, | 한국전기전자재료학회 | 2003 ,
163
Failure Analysis for High via Resistance by HDP CVD System for IMD Layer
Failure Analysis for High via Resistance by HDP CVD System for IMD Layer
Sang Yong Kim, | 한국전기전자재료학회 | 2003 ,
164
Reduction of Plasma Process Induced Damage during HDP IMD Deposition
Reduction of Plasma Process Induced Damage during HDP IMD Deposition
Sang Yong Kim, | 한국전기전자재료학회 | 2003 ,
165
Alignment Effects for Nematic Liquid Crystal on a New Diamond - like Carbon Layer
Alignment Effects for Nematic Liquid Crystal on a New Diamond - like Carbon Layer
Yong Min Jo, | 한국전기전자재료학회 | 2003 ,
166
Regular paper : Properties of Indium Tin Oxide Transparent Conductive Thin Films at Various Substrate and Annealing Temperature
Regular paper : Properties of Indium Tin Oxide Transparent Conductive Thin Films at Various Substrate and Annealing Temperature
Woon Jo Jeong, | 한국전기전자재료학회 | 2003 ,
167
Regular paper : Effects of Deposition Temperature and Annealing Process on PZT Thin Films Prepared by Pulsed Laser Deposition
Regular paper : Effects of Deposition Temperature and Annealing Process on PZT Thin Films Prepared by Pulsed Laser Deposition
Min Chul Kim, | 한국전기전자재료학회 | 2003 ,
168
Regular paper : p-n Heterojunction Composed of n-ZnO / p-Zn-doped InP
Regular paper : p-n Heterojunction Composed of n-ZnO / p-Zn-doped InP
Eun Sub Shim, | 한국전기전자재료학회 | 2003 ,
169
The Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling
The Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling
Seong Min Lee, | 한국전기전자재료학회 | 2002 ,
170
Effect of Impurities on Stress Induced Void Formation in A1 - 1%Si Conductors
Effect of Impurities on Stress Induced Void Formation in A1 - 1%Si Conductors
Seong Min Lee, | 한국전기전자재료학회 | 2002 ,
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