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1
Control Method for the Tool Path in Aspherical Surface Grinding and Polishing
Control Method for the Tool Path in Aspherical Surface Grinding and Polishing
Hyung-Tae Kim., | 한국정밀공학회 | 2006 ,
2
Chemical Mechanical Polishing Characteristics of Barium Titanate Thin Films Using Mixed Abrasive Slurry
Chemical Mechanical Polishing Characteristics of Barium Titanate Thin Films Using Mixed Abrasive Slurry
Yong-jin Seo., | 한국물리학회 | 2006 ,
3
Effect of the Hydroxyl-Ethyl-Cellulose Concentration in a Silicon Wafer Polishing Slurry on the Wafer Surface Roughness
Effect of the Hydroxyl-Ethyl-Cellulose Concentration in a Silicon Wafer Polishing Slurry on the Wafer Surface Roughness
Cho, Kyu-chul, | 한국물리학회 | 2006 ,
4
Effect of particle size of ceria coated silica and polishing pressure on chemical mechanical polishing of oxide film
Effect of particle size of ceria coated silica and polishing pressure on chemical mechanical polishing of oxide film
Kim, Hwan-Chul, | 한국전기전자재료학회 | 2007 ,
5
Dishing and erosion evaluations of tungsten CMP slurry in the orbital polishing system
Dishing and erosion evaluations of tungsten CMP slurry in the orbital polishing system
Lee, Sang-Ho, | 한국전기전자재료학회 | 2007 ,
6
Improvement of Rounding Effect in Chemical Mechanical Polishing Process for Nano-Scale Manufacturing
Improvement of Rounding Effect in Chemical Mechanical Polishing Process for Nano-Scale Manufacturing
Tae Woo Lim, Sang Hu Park, Dong-Yol Yang, Shin Wo, | 대한기계학회 | 2005 ,
7
Preparations of Silica Slurry for Wafer Polishing via Controlled Growth of Commercial Silica Seeds
Preparations of Silica Slurry for Wafer Polishing via Controlled Growth of Commercial Silica Seeds
Jae-Hyun So, Sun Hyuk Bae Seung-Man Yang, Do Hyun, | 한국화학공학회 | 2001 ,
8
Pattern Density and Pitch Effects on Chemical-Mechanical Polishing
Pattern Density and Pitch Effects on Chemical-Mechanical Polishing
Young Bae Park,Il Young Yoo, | 대한금속.재료학회 | 2001 ,
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