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Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Detailed Information
- Material Type
- 기사
- ISSN
- 12269360
- Title/Author
- Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via / Kwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho Lee, Tae Sung Oh
- Publish Info
- 서울 : 한국마이크로전자및 패키징학회, 2005.
- Material Info
- pp. 111-120
- Index Term-Uncontrolled
- INTERCONNECTION PROCESS ELECTRICAL PROPERTIES INTERCOMECTION JOINTS 3D STACK PACKAGE 75UM CU VIA
- Added Entry-Personal Name
- Kwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho Lee, Tae Sung Oh
- Host Item Entry
- 마이크로전자 및 패키징 학회지=Journal of the Microelectronics and Pack : 2005 Vol. 12 No.2 ((35)) 2005, 06
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60075297
MARC
008060503s2005 ULKa a KOR■022 ▼a12269360
■245 ▼aInterconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via▼dKwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho Lee, Tae Sung Oh
■260 ▼a서울▼b한국마이크로전자및 패키징학회▼c2005.
■300 ▼app. 111-120
■653 ▼aINTERCONNECTION▼aPROCESS▼aELECTRICAL▼aPROPERTIES▼aINTERCOMECTION▼aJOINTS▼a3D▼aSTACK▼aPACKAGE▼a75UM▼aCU▼aVIA
■700 ▼aKwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho Lee, Tae Sung Oh
■773 ▼t마이크로전자 및 패키징 학회지=Journal of the Microelectronics and Pack▼g2005 Vol. 12 No.2 ((35))▼d2005, 06
■URL ▼ahttp://www.imapsk.or.kr
■SIS ▼aS023545▼b60075252▼h8▼s2
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