서브메뉴
검색
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity
Detailed Information
- Material Type
- 기사
- ISSN
- 12269360
- Title/Author
- Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity / Myung Jin Yim, Hyoung Joon Kim, Kyung Wook Paik
- Publish Info
- 서울 : 한국마이크로전자및 패키징학회, 2005.
- Material Info
- pp. 9-16
- Index Term-Uncontrolled
- FLIP CHIP ASSEMBLY USING ANISOTROPIC CONDUCTIVE ADHESIVES ENHANCED THERMAL CONDUCTIVITY
- Added Entry-Personal Name
- Myung Jin Yim, Hyoung Joon Kim, Kyung Wook Paik
- Host Item Entry
- 마이크로전자 및 패키징 학회지=Journal of the Microelectronics and Pack : 2005 Vol. 12 No.1 ((34)) 2005, 03
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60075278
MARC
008060503s2005 ULKa a KOR■022 ▼a12269360
■245 ▼aFlip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity▼dMyung Jin Yim, Hyoung Joon Kim, Kyung Wook Paik
■260 ▼a서울▼b한국마이크로전자및 패키징학회▼c2005.
■300 ▼app. 9-16
■653 ▼aFLIP▼aCHIP▼aASSEMBLY▼aUSING▼aANISOTROPIC▼aCONDUCTIVE▼aADHESIVES▼aENHANCED▼aTHERMAL▼aCONDUCTIVITY
■700 ▼aMyung Jin Yim, Hyoung Joon Kim, Kyung Wook Paik
■773 ▼t마이크로전자 및 패키징 학회지=Journal of the Microelectronics and Pack▼g2005 Vol. 12 No.1 ((34))▼d2005, 03
■URL ▼ahttp://www.imapsk.or.kr
■SIS ▼aS023544▼b60075252▼h8▼s2
Preview
Export
ChatGPT Discussion
AI Recommended Related Books
Detail Info.
- Reservation
- Not Exist
- My Folder
- Reference Materials for Thesis Writing
- Reference Materials for Research Ethics
- Job-Related Books
