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Thermal Fatigue-Resistant EMCs (Epoxy Molding Compounds) for Microelectronic Encapsulation
Thermal Fatigue-Resistant EMCs (Epoxy Molding Compounds) for Microelectronic Encapsulation
Detailed Information
- 자료유형
- 기사
- ISSN
- 02561115
- 서명/저자
- Thermal Fatigue-Resistant EMCs (Epoxy Molding Compounds) for Microelectronic Encapsulation / Jong-Woo Bae, Wonho Kim, Suk-Hyeon Cho, Yong-Woo Hong, Jung-Eun Shin, Sang-Hyun Lee
- 발행사항
- 서울 : 한국화학공학회, 2000.
- 형태사항
- pp. 41-46
- 기본자료저록
- The KOREAN International Journal of Chemical Engineering : Vol. 17 No. 1 (2000 January) 2000, 01
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60069679
MARC
008060210s2000 ULKa a ENG■022 ▼a02561115
■245 ▼aThermal Fatigue-Resistant EMCs (Epoxy Molding Compounds) for Microelectronic Encapsulation▼dJong-Woo Bae, Wonho Kim, Suk-Hyeon Cho, Yong-Woo Hong, Jung-Eun Shin, Sang-Hyun Lee
■260 ▼a서울▼b한국화학공학회▼c2000.
■300 ▼app. 41-46
■653 ▼aTHERMAL▼aFATIGUERESISTANT▼aEMCS▼aEPOXY▼aMOLDING▼aCOMPOUNDS▼aMICROELECTRONIC▼aENCAPSULATION
■700 ▼aJong-Woo Bae, Wonho Kim, Suk-Hyeon Cho, Yong-Woo Hong, Jung-Eun Shin, Sang-Hyun Lee
■773 ▼tThe KOREAN International Journal of Chemical Engineering▼gVol. 17 No. 1 (2000 January)▼d2000, 01
■SIS ▼aS018097▼b60066239▼h8▼s2
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