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Reaction Diffusions of Cu6Sn5 and Cu₃Sn Intermetallic Compound in the Couple of Sn-3.5Ag Eutectic Solder and Copper Substrate
Reaction Diffusions of Cu6Sn5 and Cu₃Sn Intermetallic Compound in the Couple of Sn-3.5Ag Eutectic Solder and Copper Substrate
Detailed Information
- 자료유형
- 기사
- ISSN
- 12259438
- 서명/저자
- Reaction Diffusions of Cu6Sn5 and Cu₃Sn Intermetallic Compound in the Couple of Sn-3.5Ag Eutectic Solder and Copper Substrate / 공저 Jeong-Won Yoon,Chang-Bae Lee
- 발행사항
- 서울 : 대한금속.재료학회, 2003.
- 형태사항
- pp. 193-200
- 키워드
- REACTION DIFFUSIONS CU6SN5 CU₃SN INTERMETALLIC COMPOUND COUPLE SN3.5AG EUTECTIC SOLDER COPPER SUBSTRATE
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60017746
MARC
008000108s2003 ULKa a ENG■022 ▼a12259438
■245 ▼aReaction Diffusions of Cu6Sn5 and Cu₃Sn Intermetallic Compound in the Couple of Sn-3.5Ag Eutectic Solder and Copper Substrate▼d공저 Jeong-Won Yoon,Chang-Bae Lee
■260 ▼a서울▼b대한금속.재료학회▼c2003.
■300 ▼app. 193-200
■653 ▼aREACTION▼aDIFFUSIONS▼aCU6SN5▼aCU₃SN▼aINTERMETALLIC▼aCOMPOUND▼aCOUPLE▼aSN3.5AG▼aEUTECTIC▼aSOLDER▼aCOPPER▼aSUBSTRATE
■700 ▼aJeong-Won Yoon,Chang-Bae Lee
■773 ▼tMetals and Materials▼gVOL.9 NO.2 (2003 APRIL)▼d2003, 04
■SIS ▼aS009197▼b60013551▼h8▼s2
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