본문

  1. Home
2 Results:SS:VOIDS 0.46 sec.
RSS 
다국어입력
 상세검색
 신착검색
선택출력 선택엑셀내보내기
1
Stability of Interface Voids in Copper Metallization for Integrated Circuit Applications
Stability of Interface Voids in Copper Metallization for Integrated Circuit Applications
J.H. Choy, | 대한금속.재료학회 | 2004 ,
2
Evolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization
Evolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization
J.H. Choy, K.L. Kavanagh, Y.C. Kim, | 대한금속.재료학회 | 2004 ,
처음1마지막