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1
Numerical Modeling for Topographical Evolution of a 3D Micro-Electronic Device Structure
Numerical Modeling for Topographical Evolution of a 3D Micro-Electronic Device Structure
Jun-gu Lee., | 한국물리학회 | 2006 ,
2
Materials Science and Microelectronics
Materials Science and Microelectronics
S. Mahajan, | 대한금속재료학회 | 2006 ,
3
Thermal Fatigue-Resistant EMCs (Epoxy Molding Compounds) for Microelectronic Encapsulation
Thermal Fatigue-Resistant EMCs (Epoxy Molding Compounds) for Microelectronic Encapsulation
Jong-Woo Bae, Wonho Kim, Suk-Hyeon Cho, Yong-Woo, | 한국화학공학회 | 2000 ,
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1
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
2
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]