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1
Pre-Annealing Effect of Electroless Ni-B Deposit as a Diffusion Barrier for Electroplated Cu Electrodes
Pre-Annealing Effect of Electroless Ni-B Deposit as a Diffusion Barrier for Electroplated Cu Electrodes
Jae Woong Choi, Gil Ho Hwang, Won Kyu Han, Sung G, | Korean Institute of Metals and Materials | 2006 ,
2
Oxidation of Ni Films Electroplated on Steel
Oxidation of Ni Films Electroplated on Steel
Jae-Hwang Ko, Dong Bok Lee, | Metals and Materials | 2005 ,
3
Three-Dimensional Monte-Carlo Computer Simulation of Grain Growth in Electro-Plated Pure Ni
Three-Dimensional Monte-Carlo Computer Simulation of Grain Growth in Electro-Plated Pure Ni
H. S. Uhm, S. K. Hwang, | 대한금속.재료학회 | 2004 ,
4
Effects of Electroplated Cu Thickness and Plymide Plasma Treatment Conditions on the Interfacial Fracture Mechanics Parameters in the Cu/Cr/Plyimide System
Effects of Electroplated Cu Thickness and Plymide Plasma Treatment Conditions on the Interfacial Fracture Mechanics Parameters in the Cu/Cr/Plyimide System
Young Bae Park,Jin Yu, | 대한금속.재료학회 | 2001 ,
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