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2 Results:AA:TAE GUN KIM NAM HOON KIM SANG YONG KIM EUI GOO CHANG 0.609 sec.
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Optimization of Removal Rates with Guaranteed Dispersion Stability in Copper CMP Slurry
Optimization of Removal Rates with Guaranteed Dispersion Stability in Copper CMP Slurry
Tae Gun Kim, | 한국전기전자재료학회 | 2005 ,
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Stability of H2O2 as an Oxidizer for Cu CMP
Stability of H2O2 as an Oxidizer for Cu CMP
Do Won Lee, | 한국전기전자재료학회 | 2005 ,
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