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1
Development of the Power Restoration Training Simulator for Jeju Network
Development of the Power Restoration Training Simulator for Jeju Network
Heung-Jae Lee,, | 한국조명전기설비학회 | 2006 ,
2
The Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling
The Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling
Seong Min Lee, | 한국전기전자재료학회 | 2002 ,
3
Effect of Impurities on Stress Induced Void Formation in A1 - 1%Si Conductors
Effect of Impurities on Stress Induced Void Formation in A1 - 1%Si Conductors
Seong Min Lee, | 한국전기전자재료학회 | 2002 ,
4
Dynamical Mechanisms of the Continuous-Time Random Walk, Multifractals, Herd Behaviors and Minority Games in Financial Markets
Dynamical Mechanisms of the Continuous-Time Random Walk, Multifractals, Herd Behaviors and Minority Games in Financial Markets
Kyungsik KIM, | 한국물리학회 | 2007 ,
5
Corrosion Monitoring for Protected Systems Using Thin-Film Electrical Resistance (TFER) Sensor
Corrosion Monitoring for Protected Systems Using Thin-Film Electrical Resistance (TFER) Sensor
Seong-Min Lee, | 한국부식방식학회(구)한국부식학회 | 2006 ,
6
Corrosion Rate Measurement Technique with Thin Film Electric Resistance Sensor
Corrosion Rate Measurement Technique with Thin Film Electric Resistance Sensor
YoungGeun Kim, | 한국부식학회(현)한국부식방식학회 | 2002 ,
7
Thermomechanical Stability of Memory Package with LOC Structure
Thermomechanical Stability of Memory Package with LOC Structure
Seong-Min Lee, | Metals and Materials | 2005 ,
8
Processing Strategies for Enhanced Resistance to Impact Fracture of Thin Small-Outline Packages
Processing Strategies for Enhanced Resistance to Impact Fracture of Thin Small-Outline Packages
Seong-Min Lee, | 대한금속.재료학회 | 2003 ,
9
The Impact of Diamond Particles on the Susceptibility of Silicon Chips to Flexural Fracture
The Impact of Diamond Particles on the Susceptibility of Silicon Chips to Flexural Fracture
Seong-Min Lee, | 대한금속.재료학회 | 2001 ,
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