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1
The Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling
The Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling
Seong Min Lee, | 한국전기전자재료학회 | 2002 ,
2
Effect of Impurities on Stress Induced Void Formation in A1 - 1%Si Conductors
Effect of Impurities on Stress Induced Void Formation in A1 - 1%Si Conductors
Seong Min Lee, | 한국전기전자재료학회 | 2002 ,
3
Corrosion Monitoring for Protected Systems Using Thin-Film Electrical Resistance (TFER) Sensor
Corrosion Monitoring for Protected Systems Using Thin-Film Electrical Resistance (TFER) Sensor
Seong-Min Lee, | 한국부식방식학회(구)한국부식학회 | 2006 ,
4
Thermomechanical Stability of Memory Package with LOC Structure
Thermomechanical Stability of Memory Package with LOC Structure
Seong-Min Lee, | Metals and Materials | 2005 ,
5
Processing Strategies for Enhanced Resistance to Impact Fracture of Thin Small-Outline Packages
Processing Strategies for Enhanced Resistance to Impact Fracture of Thin Small-Outline Packages
Seong-Min Lee, | 대한금속.재료학회 | 2003 ,
6
The Impact of Diamond Particles on the Susceptibility of Silicon Chips to Flexural Fracture
The Impact of Diamond Particles on the Susceptibility of Silicon Chips to Flexural Fracture
Seong-Min Lee, | 대한금속.재료학회 | 2001 ,
7
연구논문 : ISO TC 211 Land Administration Domain Model(LADM)의 한국토지정보 시스템 적용 방안 연구
연구논문 : ISO TC 211 Land Administration Domain Model(LADM)의 한국토지정보 시스템 적용 방안 연구
김상민 ( Sang Min Kim ), | 한국지형공간정보학회 | 2009 ,
8
신간도서안내 : 지반개량공법 설계
신간도서안내 : 지반개량공법 설계
김명모 ( Kim Myeong Mo ), | 한국지반공학회 | 2004 ,
9
높은 아치형 지중강판 구조물의 시공 중 거동 분석
높은 아치형 지중강판 구조물의 시공 중 거동 분석
이종구 ( Lee Jong Gu ), | 한국지반공학회 | 2003 ,
10
산악 TBM 터널에서 발생한 암반파열 현상에 대한 연구
산악 TBM 터널에서 발생한 암반파열 현상에 대한 연구
이성민 ( Lee Seong Min ), | 한국지반공학회 | 2003 ,
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