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1
Piezoelectric Charge Distribution on Vibrating Diaphragms with Static Deflection and Sensitivity Improvement of Ultrasonic Sensors
Piezoelectric Charge Distribution on Vibrating Diaphragms with Static Deflection and Sensitivity Improvement of Ultrasonic Sensors
K. Yamashita, | 한국물리학회 | 2007 ,
2
Changes in micro-CT 3D bone parameters reflect effects of a potent cathepsin K inhibitor (SB-553484) on bone resorption and cortical bone formation in ovariectomized mice
Changes in micro-CT 3D bone parameters reflect effects of a potent cathepsin K inhibitor (SB-553484) on bone resorption and cortical bone formation in ovariectomized mice
Xiang, A., | Elsevier Inc | 2007 ,
3
A highly potent inhibitor of cathepsin K (relacatib) reduces biomarkers of bone resorption both in vitro and in an acute model of elevated bone turnover in vivo in monkeys
A highly potent inhibitor of cathepsin K (relacatib) reduces biomarkers of bone resorption both in vitro and in an acute model of elevated bone turnover in vivo in monkeys
Kumar, S., | Elsevier Inc | 2007 ,
4
Changes in micro-CT 3D bone parameters reflect effects of a potent cathepsin K inhibitor (SB-553484) on bone resorption and cortical bone formation in ovariectomized mice
Changes in micro-CT 3D bone parameters reflect effects of a potent cathepsin K inhibitor (SB-553484) on bone resorption and cortical bone formation in ovariectomized mice
Xiang, A., | Elsevier Inc | 2008 ,
5
Structural trends in the aging proximal femur in Japanese postmenopausal women
Structural trends in the aging proximal femur in Japanese postmenopausal women
Takada, J., | Elsevier Inc | 2007 ,
6
Polarized osteoclasts put marks of tartrate-resistant acid phosphatase on dentin slices - A simple method for identifying polarized osteoclasts
Polarized osteoclasts put marks of tartrate-resistant acid phosphatase on dentin slices - A simple method for identifying polarized osteoclasts
Nakayama, T., | Elsevier Inc | 2011 ,
7
Diamond Conditioner Wear Characterization for a Copper CMP Process
Diamond Conditioner Wear Characterization for a Copper CMP Process
L. Boruckia, | 한국전기전자재료학회 | 2008 ,
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